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NB7VQ14MMNG

Onsemi

NB7VQ14MMNG by Onsemi

NB7VQ14MMNG clock driver by Onsemi features a low propagation delay of 0.225 ns, suitable for high-speed applications up to 7000 MHz. With 8 true outputs and differential mux input conditioning, it is ideal for industrial temperature grade environments. This surface-mount chip carrier package with a very thin profile operates at a nominal voltage of 1.8 V, making it versatile for various electronic designs.

Median Price

$169.955

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 108 parts In-Stock

1+ parts

$13.340

100+ parts

$9.802

1k+ parts

$8.371

10k+ parts

$8.221

108

$13.340

$9.802

$8.371

$8.221

Chip1Stop

Japan . 95 parts In-Stock

1+ parts

$326.570

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95

$326.570

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Digiode

USA . 124 parts In-Stock

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$12.208

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$12.208

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Vyrian

USA . 2,083 parts In-Stock

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$12.850

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Flip Electronics

USA . 1,500 parts In-Stock

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Corphita

USA . 1,995 parts In-Stock

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$11.565

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$11.565

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Component Stockers USA

USA . 1,089 parts In-Stock

1+ parts

$12.460

100+ parts

$9.200

1k+ parts

$8.010

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1,089

$12.460

$9.200

$8.010

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Corohmni

South Africa . 254 parts In-Stock

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$12.850

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254

$12.850

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QUARKTWIN TECHNOLOGY LTD

USA . 24,784 parts In-Stock

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Kulean Microsystems

USA . 8,303 parts In-Stock

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Problanco Electronics

Mexico . 7,259 parts In-Stock

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TANS Electronics

Latvia . 6,327 parts In-Stock

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Microchip USA

USA . 5,652 parts In-Stock

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SupplyDigital Components

Austria . 1,403 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 566 parts In-Stock

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GreenTree Electronics

Israel . 205 parts In-Stock

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Authorized Procurement Solutions

USA . 141 parts In-Stock

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Overview

Enhance your electronic projects with the NB7VQ14MMNG clock driver & buffer by Onsemi! This high-quality chip carrier features a very thin profile and differential mux input conditioning, making it perfect for industrial applications. With a propagation delay of just 0.225ns and a maximum operating temperature of 85 °C, this component ensures top-notch performance and reliability. Take advantage of its 8 true outputs, wide supply voltage range, and quick response time to elevate your designs to the next level. Trust Onsemi's expertise and invest in the NB7VQ14MMNG for unparalleled results!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.225 ns

Low propagation delay ensures accurate and precise timing, making this product suitable for applications requiring high speed data transmission.

Surface Mount: YES

Surface mount packaging allows for easy installation and compact design, making it ideal for space-constrained applications.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning provides noise immunity and signal integrity, making it suitable for high-performance applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a common supply voltage of 1.8V, making it compatible with a wide range of systems and reducing the need for additional power conversion circuits.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Terminal Finish: NICKEL GOLD PALLADIUM

Nickel, gold, palladium terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the product.

Minimum fmax: 7000 MHz

High maximum frequency ensures compatibility with high-speed systems and allows for rapid data processing, making it ideal for high-performance applications.

Technical Specifications

Clock Drivers & Buffers NB7VQ14MMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3 AND 2.5 V SUPPLY

Family:

7VQ

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Propagation Delay At Nominal Supply:

.225 ns

Propagation Delay (tpd):

.225 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

7000 MHz

Trade Compliance

NB7VQ14MMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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