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NB7V52MMNHTBG

Onsemi

NB7V52MMNHTBG by Onsemi

NB7V52MMNHTBG clock driver by Onsemi features a propagation delay of 0.35ns, operating temperature range of -40 to 85°C, and max frequency of 10GHz. Ideal for industrial applications requiring high-speed signal conditioning in compact spaces with differential input support.

Median Price

$21.820

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 88 parts In-Stock

1+ parts

$15.240

100+ parts

$14.740

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-

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88

$15.240

$14.740

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Arrow

USA . 88 parts In-Stock

1+ parts

$21.820

100+ parts

$15.170

1k+ parts

$13.740

10k+ parts

-

88

$21.820

$15.170

$13.740

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Verical

USA . 88 parts In-Stock

1+ parts

$21.820

100+ parts

$15.170

1k+ parts

$13.740

10k+ parts

-

88

$21.820

$15.170

$13.740

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DigiKey

USA . 1,010 parts In-Stock

1+ parts

$22.970

100+ parts

$16.027

1k+ parts

$15.071

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1,010

$22.970

$16.027

$15.071

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Mouser Electronics

USA . 89 parts In-Stock

1+ parts

$22.970

100+ parts

$15.560

1k+ parts

$15.070

10k+ parts

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89

$22.970

$15.560

$15.070

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Rochester

USA . 2,977 parts In-Stock

1+ parts

-

100+ parts

$13.730

1k+ parts

$12.280

10k+ parts

$11.560

2,977

-

$13.730

$12.280

$11.560

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 728 parts In-Stock

1+ parts

$14.003

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-

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728

$14.003

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Vyrian

USA . 634 parts In-Stock

1+ parts

$14.740

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634

$14.740

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Flip Electronics

USA . 4,499 parts In-Stock

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4,499

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IBS Electronics

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$19.004

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$17.517

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400

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$19.004

$17.517

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Chip Stock

USA . 335 parts In-Stock

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335

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Distributors (Availability)

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Corphita

USA . 794 parts In-Stock

1+ parts

$13.266

100+ parts

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794

$13.266

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Corohmni

South Africa . 401 parts In-Stock

1+ parts

$14.740

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401

$14.740

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Microchip USA

USA . 3,175 parts In-Stock

1+ parts

$49.553

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3,175

$49.553

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SupplyDigital Components

Austria . 5,192 parts In-Stock

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Problanco Electronics

Mexico . 5,080 parts In-Stock

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Perfect Parts

USA . 3,482 parts In-Stock

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TANS Electronics

Latvia . 1,602 parts In-Stock

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Kulean Microsystems

USA . 607 parts In-Stock

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607

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UHIMA Technologies

Türkiye . 505 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Kepictronics

USA . 212 parts In-Stock

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Overview

Elevate your clock driver and buffer needs with the NB7V52MMNHTBG by Onsemi. This high-quality product offers unparalleled performance and reliability, backed by the trusted name of Onsemi. Perfect for a variety of applications in the Clock Drivers & Buffers category, this chip carrier package delivers a 0.35 ns propagation delay and a maximum frequency of 10 GHz. With differential input conditioning and positive edge trigger type, customers can expect seamless integration and precise timing for their projects. Upgrade your systems with the NB7V52MMNHTBG and experience the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.35 ns

With a low propagation delay at nominal supply, this clock driver can efficiently process signals with minimal delay, making it ideal for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation and assembly of this clock driver easier and more cost-effective.

Input Conditioning: DIFFERENTIAL

The use of input conditioning with a differential signal helps to reduce noise and ensure accurate signal processing in the clock driver.

Power Supplies (V): 1.8/2.5

The clock driver supports multiple power supply voltages, providing flexibility in different system configurations and power requirements.

Maximum Frequency At Nominal Supply: 10000000000 Hz

With a high maximum frequency at nominal supply, this clock driver can handle high-speed signals with ease, making it suitable for demanding applications.

Technology: ECL

The ECL technology used in this clock driver offers high-speed operation and low power consumption, making it efficient for driving clock signals in electronic systems.

Technical Specifications

Clock Drivers & Buffers NB7V52MMNHTBG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

ECL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

10000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5

Propagation Delay At Nominal Supply:

.35 ns

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

1.71 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Minimum fmax:

10000 MHz

Trade Compliance

NB7V52MMNHTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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