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NB7V52MMNTXG

Onsemi

NB7V52MMNTXG by Onsemi

NB7V52MMNTXG clock driver by Onsemi features a propagation delay of 0.35ns, operates at 1.8/2.5V, and has a max frequency of 10GHz. Ideal for industrial applications requiring high-speed signal transmission in compact spaces due to its small form factor and low power consumption.

Median Price

$19.630

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,234 parts In-Stock

1+ parts

$19.630

100+ parts

$14.150

1k+ parts

-

10k+ parts

$12.162

3,234

$19.630

$14.150

-

$12.162

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,415 parts In-Stock

1+ parts

$18.639

100+ parts

-

1k+ parts

-

10k+ parts

-

2,415

$18.639

-

-

-

Flip Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

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9,000

-

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Vyrian

USA . 5,780 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,780

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,804 parts In-Stock

1+ parts

$17.658

100+ parts

-

1k+ parts

-

10k+ parts

-

1,804

$17.658

-

-

-

Component Stockers USA

USA . 3,915 parts In-Stock

1+ parts

$19.170

100+ parts

$14.150

1k+ parts

$12.320

10k+ parts

-

3,915

$19.170

$14.150

$12.320

-

Corohmni

South Africa . 389 parts In-Stock

1+ parts

$19.620

100+ parts

-

1k+ parts

-

10k+ parts

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389

$19.620

-

-

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Microchip USA

USA . 4,012 parts In-Stock

1+ parts

$35.134

100+ parts

-

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10k+ parts

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4,012

$35.134

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-

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SupplyDigital Components

Austria . 6,759 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,759

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Perfect Parts

USA . 3,820 parts In-Stock

1+ parts

-

100+ parts

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3,820

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TANS Electronics

Latvia . 2,472 parts In-Stock

1+ parts

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2,472

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Kulean Microsystems

USA . 2,443 parts In-Stock

1+ parts

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100+ parts

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2,443

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Problanco Electronics

Mexico . 1,861 parts In-Stock

1+ parts

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100+ parts

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1,861

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UHIMA Technologies

Türkiye . 130 parts In-Stock

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130

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Overview

Enhance your electronic designs with the NB7V52MMNTXG clock driver & buffer by Onsemi. Known for their top-notch quality and reliability, Onsemi brings you a product that ensures precise timing and signal integrity in your applications. Perfect for high-speed data transmission and communication systems, this clock driver offers ultra-fast propagation delay, differential input conditioning, and a wide operating temperature range. Trust Onsemi to deliver high-performance solutions that meet your demanding requirements, giving you the competitive edge you need in today's fast-paced industry. Upgrade to the NB7V52MMNTXG and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.35 ns

Fast propagation delay ensures quick signal processing, making this clock driver suitable for high-speed applications.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, making this clock driver suitable for precision timing applications.

Power Supplies (V): 1.8/2.5

Versatile power supply options allow flexibility in different circuit configurations and voltage requirements.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offered provides options for different mounting and cooling requirements, enhancing the usability of this clock driver.

Propagation Delay (tpd): 0.6 ns

Low propagation delay ensures efficient signal transmission and synchronization, especially in high-performance systems.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows this clock driver to function reliably in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures ensures consistent performance even in extreme cold environments, enhancing the versatility of this clock driver.

Maximum Seated Height: 1 mm

Low profile design enables compact and space-saving integration of this clock driver into electronic systems or PCB layouts.

Minimum Supply Voltage (Vsup): 1.71 V

Ability to operate at low supply voltage levels allows for energy-efficient operation and compatibility with lower power designs.

Maximum Frequency At Nominal Supply: 10,000,000,000 Hz

High maximum frequency capability enables precise and accurate timing control, making this clock driver suitable for demanding applications.

Technical Specifications

Clock Drivers & Buffers NB7V52MMNTXG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

ECL

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

10000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5

Propagation Delay At Nominal Supply:

.35 ns

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

1.71 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Minimum fmax:

10000 MHz

Trade Compliance

NB7V52MMNTXG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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