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NB7L585RMNR4G

Onsemi

NB7L585RMNR4G by Onsemi

NB7L585RMNR4G clock driver by Onsemi features a low propagation delay of 0.3 ns and differential mux input conditioning, suitable for high-speed applications up to 6000 MHz. With a package style of chip carrier and very thin profile, it operates within an industrial temperature range from -40 to 85 °C.

Median Price

$8.134

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,580 parts In-Stock

1+ parts

-

100+ parts

$7.230

1k+ parts

$6.470

10k+ parts

$6.090

1,580

-

$7.230

$6.470

$6.090

Verical

USA . 1,580 parts In-Stock

1+ parts

-

100+ parts

$9.037

1k+ parts

$8.088

10k+ parts

$7.612

1,580

-

$9.037

$8.088

$7.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,011 parts In-Stock

1+ parts

$7.657

100+ parts

-

1k+ parts

-

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-

2,011

$7.657

-

-

-

Vyrian

USA . 5,035 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

5,035

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,220 parts In-Stock

1+ parts

$7.254

100+ parts

-

1k+ parts

-

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1,220

$7.254

-

-

-

Corohmni

South Africa . 303 parts In-Stock

1+ parts

$8.060

100+ parts

-

1k+ parts

-

10k+ parts

-

303

$8.060

-

-

-

AZTECH Wire

Italy . 328 parts In-Stock

1+ parts

$16.560

100+ parts

-

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328

$16.560

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 8,636 parts In-Stock

1+ parts

-

100+ parts

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8,636

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-

-

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SupplyDigital Components

Austria . 7,667 parts In-Stock

1+ parts

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7,667

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Problanco Electronics

Mexico . 5,877 parts In-Stock

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5,877

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Microchip USA

USA . 5,548 parts In-Stock

1+ parts

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5,548

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TANS Electronics

Latvia . 4,439 parts In-Stock

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4,439

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Kulean Microsystems

USA . 3,233 parts In-Stock

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Metaverse IC Inc.

Canada . 130 parts In-Stock

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130

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UHIMA Technologies

Türkiye . 35 parts In-Stock

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35

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Overview

Elevate your clock driver and buffer needs with the NB7L585RMNR4G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that exceed expectations. Clock Drivers & Buffers are essential for ensuring smooth data transmission and precision timing in various applications. With a minimal propagation delay of 0.3 ns and differential mux input conditioning, this product offers unparalleled performance. Experience the benefits of reliable signal integrity, reduced noise, and enhanced overall system efficiency with the NB7L585RMNR4G. Choose Onsemi for cutting-edge technology that sets you apart from the competition.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.3 ns

Low propagation delay ensures quick signal transmission, making this clock driver efficient for time-critical applications.

Surface Mount: YES

The surface mount feature allows for easy and space-saving installation on PCBs, making it convenient for compact designs.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning enables reliable data transmission and noise immunity, ensuring signal integrity.

Nominal Supply Voltage / Vsup: 2.5V

Operating at a standard nominal supply voltage of 2.5V makes this clock driver compatible with a wide range of systems and power supplies.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this clock driver can withstand extreme environmental conditions, suitable for industrial applications.

Maximum Same Edge Skew: 0.02 ns

The low same edge skew ensures accurate timing synchronization between multiple signals, reducing signal distortion and improving system performance.

Technical Specifications

Clock Drivers & Buffers NB7L585RMNR4G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3 V

Family:

7L

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.3 ns

Propagation Delay (tpd):

.225 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

6000 MHz

Trade Compliance

NB7L585RMNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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