Loading...

NB7L585MNTWG

Onsemi

NB7L585MNTWG by Onsemi

NB7L585MNTWG clock driver by Onsemi features a low propagation delay of 0.3ns, differential mux input conditioning, and 12 true outputs. Ideal for industrial applications requiring precise timing control, this chip carrier package with a very thin profile operates at temperatures ranging from -40 to 85 °C.

Median Price

$8.168

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,404 parts In-Stock

1+ parts

-

100+ parts

$7.260

1k+ parts

$6.490

10k+ parts

$6.110

1,404

-

$7.260

$6.490

$6.110

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$9.075

1k+ parts

$8.113

10k+ parts

-

1,000

-

$9.075

$8.113

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,050 parts In-Stock

1+ parts

$7.657

100+ parts

-

1k+ parts

-

10k+ parts

-

2,050

$7.657

-

-

-

Vyrian

USA . 8,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,668

-

-

-

-

Flip Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

IBS Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.930

10k+ parts

-

4,000

-

-

$9.930

-

NAC Semi

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$12.900

10k+ parts

$11.730

2,000

-

-

$12.900

$11.730

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,060 parts In-Stock

1+ parts

$6.850

100+ parts

-

1k+ parts

-

10k+ parts

-

1,060

$6.850

-

-

-

Corphita

USA . 2,406 parts In-Stock

1+ parts

$7.254

100+ parts

-

1k+ parts

-

10k+ parts

-

2,406

$7.254

-

-

-

Corohmni

South Africa . 130 parts In-Stock

1+ parts

$8.060

100+ parts

-

1k+ parts

-

10k+ parts

-

130

$8.060

-

-

-

A-Z Elektronik GmbH

Germany . 4,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,791

-

-

-

-

Kulean Microsystems

USA . 2,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,735

-

-

-

-

Problanco Electronics

Mexico . 2,544 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,544

-

-

-

-

SupplyDigital Components

Austria . 1,445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,445

-

-

-

-

Continental Prestige Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

UHIMA Technologies

Türkiye . 893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

893

-

-

-

-

TANS Electronics

Latvia . 623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

623

-

-

-

-

Kepictronics

USA . 58 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

58

-

-

-

-

Overview

Enhance the performance of your clock drivers and buffers with the NB7L585MNTWG from Onsemi. Designed for precision and reliability, this product offers a fast propagation delay of 0.3 ns and operates seamlessly at a wide range of temperatures. With 12 true outputs and differential mux input conditioning, it's ideal for a variety of applications. Enjoy the quality craftsmanship of Onsemi and elevate your electronic projects with this cutting-edge chip carrier. Upgrade your systems with the value and efficiency that only Onsemi can provide.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.3 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed clock applications.

Surface Mount: YES

Surface mount technology allows for easy and compact installation on printed circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape provides uniformity and ease of integration into circuits, enhancing overall design aesthetics.

Nominal Supply Voltage / Vsup (V): 2.5

Standard supply voltage compatibility ensures compatibility with common power sources, simplifying integration into existing systems.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable performance in diverse environmental conditions, making this product suitable for industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides corrosion resistance and improved solderability, extending the product's lifespan and ensuring reliable connections.

Technical Specifications

Clock Drivers & Buffers NB7L585MNTWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3 TO 3.6 V SUPPLY

Family:

NB7

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.3 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB7L585MNTWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20