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NB4L339MNR4G

Onsemi

NB4L339MNR4G by Onsemi

NB4L339MNR4G clock driver by Onsemi features 5ns propagation delay, operates at 2.5/3.3V, and offers differential input conditioning. Ideal for industrial applications requiring high-speed signal synchronization in a compact square package with 32 terminals.

Median Price

$16.132

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,912 parts In-Stock

1+ parts

-

100+ parts

$14.340

1k+ parts

$12.830

10k+ parts

$12.070

3,912

-

$14.340

$12.830

$12.070

Verical

USA . 1,989 parts In-Stock

1+ parts

-

100+ parts

$17.925

1k+ parts

$16.038

10k+ parts

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1,989

-

$17.925

$16.038

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Distributors (In-Stock)

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Digiode

USA . 2,355 parts In-Stock

1+ parts

$15.172

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2,355

$15.172

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Vyrian

USA . 4,646 parts In-Stock

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4,646

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Extreme Components

USA . 562 parts In-Stock

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562

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Distributors (Availability)

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Corphita

USA . 1,237 parts In-Stock

1+ parts

$14.373

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-

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1,237

$14.373

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Corohmni

South Africa . 399 parts In-Stock

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$14.430

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399

$14.430

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Component Stockers USA

USA . 4,867 parts In-Stock

1+ parts

$16.450

100+ parts

$15.460

1k+ parts

$13.980

10k+ parts

-

4,867

$16.450

$15.460

$13.980

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AZTECH Wire

Italy . 940 parts In-Stock

1+ parts

$19.640

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940

$19.640

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Problanco Electronics

Mexico . 7,671 parts In-Stock

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Kulean Microsystems

USA . 6,596 parts In-Stock

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TANS Electronics

Latvia . 4,659 parts In-Stock

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Perfect Parts

USA . 3,965 parts In-Stock

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Continental Prestige Electronics

USA . 3,912 parts In-Stock

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$13.600

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SupplyDigital Components

Austria . 1,563 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 820 parts In-Stock

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820

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Kepictronics

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Microchip USA

USA . 183 parts In-Stock

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Overview

Unlock the power of precision and reliability with the NB4L339MNR4G clock driver by Onsemi. Designed to meet the highest industry standards, this product boasts unparalleled quality and efficiency. Ideal for a wide range of applications in clock distribution systems, its differential input conditioning ensures optimal performance. With a nominal supply voltage of 2.5V and a maximum operating temperature of 85 °C, this chip carrier offers customers exceptional value and peace of mind. Trust Onsemi for cutting-edge technology that delivers results.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 5 ns

Low propagation delay ensures fast and accurate signal transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and secure PCB integration, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL

Differential input conditioning provides noise immunity and reliable signal transfer, making the product suitable for noise-sensitive environments.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a common voltage 2.5V, making it compatible with many systems and reducing the need for additional components for voltage regulation.

Power Supplies (V): 2.5/3.3

Supports multiple power supply voltages, allowing for versatile usage in different systems without the need for additional voltage conversion.

No. of Terminals: 32

Multiple terminals provide connectivity options and support for complex circuit designs, making it suitable for applications requiring multiple connections.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable operation in both extreme cold and hot conditions, ensuring durability and stability in various environments.

Technical Specifications

Clock Drivers & Buffers NB4L339MNR4G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

4L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.19 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

700 MHz

Trade Compliance

NB4L339MNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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