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NB4L7210MNG

Onsemi

NB4L7210MNG by Onsemi

NB4L7210MNG by Onsemi is a clock driver with 30.8 ns propagation delay, suitable for industrial applications. It operates at 2.5V nominal voltage and has 52 terminals in a square package style. With differential input conditioning, it offers 10 true outputs and can handle up to 3.6V max supply voltage.

Median Price

$17.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 822 parts In-Stock

1+ parts

-

100+ parts

$15.710

1k+ parts

$14.060

10k+ parts

$13.230

822

-

$15.710

$14.060

$13.230

Avnet

USA . 822 parts In-Stock

1+ parts

-

100+ parts

$17.140

1k+ parts

$16.130

10k+ parts

-

822

-

$17.140

$16.130

-

DigiKey

USA . 822 parts In-Stock

1+ parts

-

100+ parts

$18.200

1k+ parts

$18.200

10k+ parts

$18.200

822

-

$18.200

$18.200

$18.200

Verical

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$19.637

1k+ parts

$17.575

10k+ parts

$16.538

520

-

$19.637

$17.575

$16.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,236 parts In-Stock

1+ parts

$16.625

100+ parts

-

1k+ parts

-

10k+ parts

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2,236

$16.625

-

-

-

Vyrian

USA . 4,092 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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4,092

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 325 parts In-Stock

1+ parts

$14.690

100+ parts

-

1k+ parts

-

10k+ parts

-

325

$14.690

-

-

-

Corphita

USA . 1,418 parts In-Stock

1+ parts

$15.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,418

$15.750

-

-

-

Component Stockers USA

USA . 783 parts In-Stock

1+ parts

$18.050

100+ parts

$16.970

1k+ parts

-

10k+ parts

-

783

$18.050

$16.970

-

-

Kulean Microsystems

USA . 6,931 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,931

-

-

-

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Problanco Electronics

Mexico . 6,517 parts In-Stock

1+ parts

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100+ parts

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6,517

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-

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TANS Electronics

Latvia . 3,499 parts In-Stock

1+ parts

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100+ parts

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3,499

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-

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SupplyDigital Components

Austria . 1,967 parts In-Stock

1+ parts

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100+ parts

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1,967

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UHIMA Technologies

Türkiye . 243 parts In-Stock

1+ parts

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243

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Microchip USA

USA . 129 parts In-Stock

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129

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Overview

Enhance your clock driving capabilities with the NB4L7210MNG from Onsemi. Known for their high-quality products, Onsemi delivers reliable Clock Drivers & Buffers that are essential for a wide range of applications. This chip carrier, very thin profile package offers differential input conditioning and a fast propagation delay of just 30.8 ns, ensuring precise timing in industrial settings. With a nominal supply voltage of 2.5V, this clock driver is versatile and efficient. Upgrade your systems with Onsemi's NB4L7210MNG for seamless performance and unmatched reliability.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 30.8 ns

This product offers fast propagation delay, making it suitable for applications where timing is critical.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into your circuit board, saving space and facilitating automated assembly.

Input Conditioning: DIFFERENTIAL

The differential input conditioning helps in reducing noise and improving signal integrity, making this product reliable in noisy environments.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a standard supply voltage of 2.5V, this product can be easily integrated into existing systems without the need for additional power conversion.

No. of True Outputs: 10

With 10 true outputs, this product provides multiple options for distributing clock signals, making it versatile for various applications.

Technical Specifications

Clock Drivers & Buffers NB4L7210MNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

4L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N52

JESD-609 Code:

e3

Length:

8 mm

Logic IC Type:

Maximum I (ol):

1 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC52,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

30.8 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

NB4L7210MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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