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NB4L6254FAG

Onsemi

NB4L6254FAG by Onsemi

NB4L6254FAG clock driver by Onsemi features a propagation delay of 0.485 ns, 32 terminals, and operates at a temperature range of -40 to 85 °C. It is designed for applications requiring high-speed differential input conditioning and offers 6 true outputs with a min fmax of 3000 MHz. Ideal for industrial settings needing precise clock signal distribution.

Median Price

$11.300

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 7,035 parts In-Stock

1+ parts

-

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-

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$11.300

10k+ parts

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7,035

-

-

$11.300

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Rochester

USA . 6,737 parts In-Stock

1+ parts

-

100+ parts

$11.220

1k+ parts

$10.040

10k+ parts

$9.450

6,737

-

$11.220

$10.040

$9.450

Verical

USA . 3,240 parts In-Stock

1+ parts

-

100+ parts

$14.688

1k+ parts

$13.287

10k+ parts

-

3,240

-

$14.688

$13.287

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 181 parts In-Stock

1+ parts

$11.875

100+ parts

-

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181

$11.875

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$11.880

100+ parts

-

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50

$11.880

-

-

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Vyrian

USA . 3,944 parts In-Stock

1+ parts

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3,944

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,607 parts In-Stock

1+ parts

$9.610

100+ parts

-

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5,607

$9.610

-

-

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Corphita

USA . 1,212 parts In-Stock

1+ parts

$11.250

100+ parts

-

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1,212

$11.250

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-

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Corohmni

South Africa . 101 parts In-Stock

1+ parts

$11.300

100+ parts

-

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101

$11.300

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$11.642

100+ parts

-

1k+ parts

$11.177

10k+ parts

-

50

$11.642

-

$11.177

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Component Stockers USA

USA . 8,077 parts In-Stock

1+ parts

$12.800

100+ parts

$12.030

1k+ parts

$10.880

10k+ parts

-

8,077

$12.800

$12.030

$10.880

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AZTECH Wire

Italy . 163 parts In-Stock

1+ parts

$16.180

100+ parts

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163

$16.180

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SupplyDigital Components

Austria . 7,475 parts In-Stock

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7,475

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Continental Prestige Electronics

USA . 6,795 parts In-Stock

1+ parts

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100+ parts

$10.640

1k+ parts

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6,795

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$10.640

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A-Z Elektronik GmbH

Germany . 5,039 parts In-Stock

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5,039

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kulean Microsystems

USA . 3,415 parts In-Stock

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3,415

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TANS Electronics

Latvia . 1,839 parts In-Stock

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1,839

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Problanco Electronics

Mexico . 1,397 parts In-Stock

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1,397

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UHIMA Technologies

Türkiye . 385 parts In-Stock

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385

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Microchip USA

USA . 295 parts In-Stock

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295

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Overview

Enhance the performance of your electronic devices with the NB4L6254FAG clock driver & buffer from Onsemi. Designed with precision and reliability in mind, this product ensures top-notch quality and seamless operation. Ideal for a wide range of applications, this clock driver & buffer offers unmatched value, providing customers with improved efficiency and functionality. Trust Onsemi's expertise and innovation to elevate your electronics to the next level with the NB4L6254FAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Propagation Delay At Nominal Supply: 0.61 ns

The low propagation delay ensures fast and efficient operation of the clock driver.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs.

Input Conditioning: DIFFERENTIAL

The differential input conditioning helps in improving signal integrity and reducing noise interference.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage is common in many electronic systems, making this product versatile.

Power Supplies (V): 2.5/3.3

The compatibility with multiple power supply voltages makes it suitable for a variety of applications.

No. of Terminals: 32

The ample number of terminals allow for connectivity with other components in the circuit.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design saves space and enhances the overall aesthetics of the product.

Propagation Delay (tpd): 0.485 ns

The extremely low propagation delay ensures high-speed data transmission.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environments.

Output Characteristics: 3-STATE

The 3-state output feature allows for flexible control over the output signal.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in a wide range of operating conditions.

Terminal Finish: TIN

The terminal finish with tin coating provides corrosion resistance and ensures a reliable connection.

Terminal Position: QUAD

The quad terminal position allows for easy connection and integration into the circuit.

Maximum Seated Height: 1.6 mm

The low maximum seated height provides a compact design for space-constrained applications.

Width: 7 mm

The narrow width allows for efficient use of space on the PCB.

Minimum Supply Voltage (Vsup): 2.375 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during assembly.

Length: 7 mm

The compact length of the product saves space on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in tough industrial environments.

Technology: BIPOLAR

The bipolar technology offers high-speed performance and efficiency.

Terminal Form: GULL WING

The gull-wing terminal form provides strong mechanical support and ease of soldering.

Terminal Pitch: 0.8 mm

The tight terminal pitch allows for compact terminal placement on the PCB.

Maximum Same Edge Skew (tskwd): 0.05 ns

The low skew value ensures accurate synchronization of signals.

No. of True Outputs: 6

The multiple true output channels provide flexibility in signal routing and processing.

Minimum fmax: 3000 MHz

The high minimum operating frequency ensures compatibility with high-speed applications.

Moisture Sensitivity Level (MSL): 2

The MSL rating of 2 indicates the level of protection against moisture exposure.

Maximum Supply Voltage (Vsup): 3.465 V

The high maximum supply voltage tolerance ensures robustness against voltage spikes and fluctuations.

Technical Specifications

Clock Drivers & Buffers NB4L6254FAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

4L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.61 ns

Propagation Delay (tpd):

.485 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Minimum fmax:

3000 MHz

Trade Compliance

NB4L6254FAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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