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NB4L339MNR2G

Onsemi

NB4L339MNR2G by Onsemi

NB4L339MNR2G by Onsemi is a Clock Driver with 1.3ns Propagation Delay, 32 Terminals, and 8 True Outputs. It operates at -40 to 85 °C, suitable for industrial applications requiring high-speed signal conditioning in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 422 parts In-Stock

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Digiode

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TANS Electronics

Latvia . 7,821 parts In-Stock

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Problanco Electronics

Mexico . 7,170 parts In-Stock

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SupplyDigital Components

Austria . 3,190 parts In-Stock

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Kulean Microsystems

USA . 1,326 parts In-Stock

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Corphita

USA . 1,295 parts In-Stock

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UHIMA Technologies

Türkiye . 463 parts In-Stock

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Corohmni

South Africa . 418 parts In-Stock

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Overview

Enhance your clock signal management with the NB4L339MNR2G by Onsemi. Designed with precision and reliability in mind, this clock driver offers unparalleled performance for a wide range of applications. With a low propagation delay of just 1.3 ns, differential input conditioning, and a variety of power supply options, this product ensures seamless operation in industrial environments. Trust Onsemi's reputation for quality and innovation to deliver the best-in-class clock drivers & buffers that meet your specific needs. Elevate your designs with the NB4L339MNR2G and experience the difference in signal integrity and efficiency.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 1.3 ns

Low propagation delay ensures fast signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easier and more efficient PCB assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space.

Nominal Supply Voltage: 2.5V

Suitable for applications requiring a 2.5V supply voltage.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without any issues.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments without any issues.

Minimum Supply Voltage: 2.375 V

Allows for operation at lower supply voltages, increasing flexibility in design.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing a wider operating range.

Technical Specifications

Clock Drivers & Buffers NB4L339MNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

4L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

1.3 ns

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.19 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Minimum fmax:

700 MHz

Trade Compliance

NB4L339MNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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