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NB4L6254MNG

Onsemi

NB4L6254MNG by Onsemi

NB4L6254MNG clock driver by Onsemi features a propagation delay of 0.61 ns, operates at a nominal voltage of 2.5V, and offers 6 true outputs with a min frequency of 3000 MHz. Ideal for industrial applications requiring high-speed signal conditioning in compact spaces due to its small chip carrier package style and low power consumption.

Median Price

$12.240

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,283 parts In-Stock

1+ parts

-

100+ parts

$11.220

1k+ parts

$10.040

10k+ parts

$9.450

4,283

-

$11.220

$10.040

$9.450

Avnet

USA . 4,283 parts In-Stock

1+ parts

-

100+ parts

$12.240

1k+ parts

$11.520

10k+ parts

-

4,283

-

$12.240

$11.520

-

Verical

USA . 4,283 parts In-Stock

1+ parts

-

100+ parts

$14.025

1k+ parts

$12.550

10k+ parts

$11.813

4,283

-

$14.025

$12.550

$11.813

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,252 parts In-Stock

1+ parts

$11.875

100+ parts

-

1k+ parts

-

10k+ parts

-

1,252

$11.875

-

-

-

Vyrian

USA . 8,013 parts In-Stock

1+ parts

-

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8,013

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-

-

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Bristol Electronics

USA . 44 parts In-Stock

1+ parts

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44

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Flex Direct, LLC

USA . 44 parts In-Stock

1+ parts

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44

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 423 parts In-Stock

1+ parts

$10.500

100+ parts

-

1k+ parts

-

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423

$10.500

-

-

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Corphita

USA . 580 parts In-Stock

1+ parts

$11.250

100+ parts

-

1k+ parts

-

10k+ parts

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580

$11.250

-

-

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AZTECH Wire

Italy . 1,198 parts In-Stock

1+ parts

$13.570

100+ parts

-

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1,198

$13.570

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SupplyDigital Components

Austria . 8,258 parts In-Stock

1+ parts

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8,258

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Problanco Electronics

Mexico . 7,546 parts In-Stock

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7,546

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TANS Electronics

Latvia . 7,017 parts In-Stock

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7,017

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Kulean Microsystems

USA . 3,551 parts In-Stock

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3,551

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UHIMA Technologies

Türkiye . 690 parts In-Stock

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690

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Microchip USA

USA . 162 parts In-Stock

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162

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Overview

Enhance your clock driver and buffer applications with the NB4L6254MNG by Onsemi. Manufactured with precision and quality in mind, this product offers unmatched reliability and performance. With a fast propagation delay of 0.61 ns and 3-state output characteristics, this chip carrier is perfect for industrial use. Its differential input conditioning and very thin profile make it ideal for various electronic devices. Experience the benefits of Onsemi's cutting-edge technology and ensure seamless operation with the NB4L6254MNG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 0.61 ns

The low propagation delay ensures fast and efficient signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and flexible installation on printed circuit boards, saving space and simplifying the assembly process.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and interference, leading to reliable and accurate signal processing.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage ensures compatibility with a wide range of systems and devices, making this product versatile and widely applicable.

Power Supplies (V): 2.5/3.3

The dual power supply options allow for flexibility in voltage requirements, accommodating different system configurations and operating conditions.

No. of Terminals: 32

The 32 terminals provide ample connectivity options for interfacing with other components, making this product suitable for complex circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package styles offer thermal management capabilities and space-saving designs, enhancing the product's performance and versatility.

Propagation Delay (tpd): 0.485 ns

The low propagation delay contributes to the high-speed operation of the product, ensuring quick and efficient signal transmission.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable performance in various environmental conditions, making this product suitable for industrial applications.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in signal control and manipulation, enhancing the product's functionality in complex circuit designs.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable performance even in extreme cold conditions, making this product suitable for diverse operating environments.

Terminal Position: QUAD

The quad terminal position offers convenient connectivity options and easy integration with other components, simplifying the installation and assembly process.

Technology: BIPOLAR

The bipolar technology used in this product ensures stable and accurate signal processing, making it reliable for high-performance applications.

Technical Specifications

Clock Drivers & Buffers NB4L6254MNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

4L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

.61 ns

Propagation Delay (tpd):

.485 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

3000 MHz

Trade Compliance

NB4L6254MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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