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MTB36N06VT4

Onsemi

MTB36N06VT4 by Onsemi

MTB36N06VT4 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 32A Drain Current, and 0.04 ohm On Resistance. Ideal for SWITCHING applications, it features a built-in DIODE and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it has a max power dissipation of 90W at 175 °C.

Median Price

$3.340

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 354 parts In-Stock

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$3.340

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$3.507

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J2 Sourcing AB

Sweden . 1,290 parts In-Stock

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Vyrian

USA . 1,241 parts In-Stock

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Semi Source

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800

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Digiode

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ComSIT Distribution GmbH

Germany . 62 parts In-Stock

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

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$1.061

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Corohmni

South Africa . 429 parts In-Stock

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SupplyDigital Components

Austria . 7,278 parts In-Stock

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Problanco Electronics

Mexico . 6,308 parts In-Stock

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Kulean Microsystems

USA . 3,687 parts In-Stock

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 937 parts In-Stock

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TANS Electronics

Latvia . 241 parts In-Stock

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Corphita

USA . 85 parts In-Stock

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Overview

Discover the power and efficiency of the MTB36N06VT4 by Onsemi, a top-quality Power FET that stands out in its category. With a focus on switching applications, this N-CHANNEL transistor offers customers unbeatable value with its single configuration and built-in diode. Whether you're looking for enhanced performance or reliable operation, this transistor delivers it all. Trust in Onsemi's reputation for excellence and choose the MTB36N06VT4 for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the transistor lightweight and durable, suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility and faster switching speeds, making them ideal for high-frequency switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing the overall efficiency and reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and high efficiency, making it ideal for power control circuits.

Surface Mount: YES

Being surface mountable makes the transistor easy to install on PCBs, saving space and enabling automated assembly processes.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage allows the transistor to handle high voltage loads, making it suitable for a wide range of power applications.

Maximum Pulsed Drain Current (IDM): 112 A

The high pulsed drain current rating enables the transistor to handle short-duration high-current pulses, making it suitable for applications with varying load demands.

Avalanche Energy Rating (EAS): 205 mJ

The high avalanche energy rating indicates the transistor's ability to withstand voltage spikes and transient events, increasing the overall reliability of the circuit.

Maximum Power Dissipation (Abs): 90 W

The high power dissipation rating allows the transistor to handle high power levels without overheating, ensuring long-term reliability in demanding applications.

Maximum Drain-Source On Resistance: 0.04 ohm

The low drain-source on resistance results in minimal power loss and heat generation during operation, improving efficiency and reducing thermal issues.

Technical Specifications

Power Field Effect Transistors (FET) MTB36N06VT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

205 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

32 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

112 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTB36N06VT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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