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MTB3N120ET4

Onsemi

MTB3N120ET4 by Onsemi

The Onsemi MTB3N120ET4 is a N-CHANNEL FET with 3A max drain current and 125W power dissipation. Ideal for power applications, it operates in enhancement mode at up to 150 °C, making it suitable for various surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,434 parts In-Stock

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Digiode

USA . 2,073 parts In-Stock

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TANS Electronics

Latvia . 8,177 parts In-Stock

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Problanco Electronics

Mexico . 6,269 parts In-Stock

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SupplyDigital Components

Austria . 6,000 parts In-Stock

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Corphita

USA . 1,414 parts In-Stock

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Kulean Microsystems

USA . 1,338 parts In-Stock

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Corohmni

South Africa . 352 parts In-Stock

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UHIMA Technologies

Türkiye . 278 parts In-Stock

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Overview

Unleash the power of innovation with the MTB3N120ET4 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are designed for superior performance and reliability. Ideal for a range of applications, this N-CHANNEL transistor offers enhanced power efficiency and thermal management. Experience the value of maximum power dissipation of 125 W and a peak reflow temperature of 235 °C, providing customers with unparalleled benefits and advantages. Upgrade your electronics with the MTB3N120ET4 and see the difference for yourself.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and fast switching speeds, making them ideal for use in power applications.

Configuration: SINGLE

Single configuration FETs are easy to set up and provide a straightforward solution for power control requirements.

Surface Mount: YES

Surface mount FETs offer space-saving benefits and are suitable for compact electronic designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require less power to operate and offer better control over the flow of current.

Maximum Drain Current (Abs): 3 A

With a high maximum drain current of 3 A, this FET can handle heavy loads and ensure reliable performance in power circuits.

Maximum Power Dissipation (Abs): 125 W

The high power dissipation capability of 125 W ensures that the FET can operate efficiently without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers a good balance between power handling capabilities and efficiency in FETs.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperatures and operate reliably in demanding environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and reliability in the FET's connections.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C ensures that the FET can withstand the soldering process without any damage.

Technical Specifications

Power Field Effect Transistors (FET) MTB3N120ET4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e0

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Trade Compliance

MTB3N120ET4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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