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MTB30P06V

Onsemi

MTB30P06V by Onsemi

The Onsemi MTB30P06V is a P-CHANNEL FET with 60V DS Breakdown Voltage and 105A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.08 ohm RDS(on), and 125W Power Dissipation. The METAL-OXIDE SEMICONDUCTOR technology ensures reliable performance in various environments at up to 175 °C.

Median Price

$0.471

Lifecycle Status

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Vyrian

USA . 498 parts In-Stock

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Digiode

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Inventory MP

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Sea View Technologies

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Connector Distribution Corp

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Right Parts Inc.

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Sunrise Surplus Inc.

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ECAB

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Speed Components Ltd

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Corohmni

South Africa . 460 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic projects with the MTB30P06V Power Field Effect Transistor by Onsemi. Designed for switching applications, this P-CHANNEL FET offers a maximum drain current of 30 A and a minimum DS breakdown voltage of 60 V. With a package shape that's both compact and durable, it's perfect for a wide range of projects. Trust in Onsemi's reputation for quality and reliability, and experience the value and benefits this transistor brings to your designs. Upgrade your electronics with the MTB30P06V today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Polarity or Channel Type: P-CHANNEL

P-channel FETs can offer lower ON-resistance and higher power efficiency compared to N-channel FETs in certain applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for improved efficiency and protection in circuits where reverse current flow needs to be managed.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently turn on and off high currents, making it ideal for power control.

Surface Mount: YES

The surface mount capability makes installation easier and saves space on the PCB, enhancing overall design flexibility.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off and require a positive voltage on the gate to switch on, providing better control over the switching operation.

Maximum Drain Current (ID): 30 A

With a high maximum drain current, this FET can handle heavy loads without overheating or experiencing performance issues.

Maximum Power Dissipation (Abs): 125 W

The high power dissipation rating ensures the FET can handle power spikes and continuous operation without risk of damage.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the FET to function reliably in demanding environments without overheating.

Maximum Drain-Source On Resistance: 0.08 ohm

Low ON resistance leads to minimal power loss and heat generation, improving overall efficiency and performance of the circuit.

Technical Specifications

Power Field Effect Transistors (FET) MTB30P06V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

450 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

105 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTB30P06V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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