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MR754RL

Onsemi

MR754RL by Onsemi

MR754RL by Onsemi is a Schottky rectifier diode with 400V reverse voltage, 6A output current, and 1.25V forward voltage. It is used in applications requiring high efficiency power conversion such as power supplies and battery chargers.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

USA . 35,000 parts In-Stock

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Digiode

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Component Stockers USA

USA . 213 parts In-Stock

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$99.990

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Kulean Microsystems

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TANS Electronics

Latvia . 6,578 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

Austria . 4,807 parts In-Stock

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Problanco Electronics

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Türkiye . 466 parts In-Stock

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Overview

Unleash the power of innovation with the MR754RL by Onsemi! This top-of-the-line rectifier diode is designed to deliver unmatched quality and performance, making it the ideal choice for a wide range of applications. From industrial equipment to consumer electronics, this diode's Schottky technology ensures optimal efficiency and reliability. Trust in Onsemi's reputation for excellence and invest in the MR754RL for superior results every time. Upgrade your project with the value and benefits that only Onsemi can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the diode, ensuring long-lasting performance.

Config: SINGLE

Simplified configuration for easy installation and maintenance.

Package Shape: ROUND

Compact shape that can fit well in various electronic designs.

No. of Terminals: 2

Simplifies the connection process and reduces the chances of errors.

Package Style: DISK BUTTON

Easy to handle and integrate into circuit designs.

Maximum Operating Temperature: 175 °C

Can withstand high temperatures, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Ensures good conductivity and reliability in connection.

Terminal Position: AXIAL

Facilitates easy mounting and connection in a circuit.

Case Connection: ISOLATED

Ensures electrical isolation to prevent interference and damage.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during soldering processes.

Diode Type: RECTIFIER DIODE

Ideal for converting AC to DC with low forward voltage drop.

Maximum Forward Voltage (VF): 1.25 V

Efficiently converts voltage with minimal power loss.

Maximum Output Current: 6 A

Suitable for applications requiring high current output.

Technology: SCHOTTKY

Provides fast switching speed and low forward voltage drop.

Terminal Form: WIRE

Easy to connect and integrate into circuits.

Maximum Repetitive Peak Reverse Voltage: 400 V

Can handle high reverse voltages, offering robust protection.

Maximum Non Repetitive Peak Forward Current: 400 A

Capable of handling high surge currents for added reliability.

Diode Element Material: SILICON

Highly efficient and reliable material for diode construction.

Technical Specifications

Diodes & Rectifiers MR754RL attributes and parameters. Explore more Diodes & Rectifiers devices from Onsemi

Specs

Application:

GENERAL PURPOSE

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1.25 V

JESD-30 Code:

O-PADB-W2

JESD-609 Code:

e0

Maximum Non Repetitive Peak Forward Current:

400 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

DISK BUTTON

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

400 V

Sub-Category:

Rectifier Diodes

Surface Mount:

NO

Technology:

SCHOTTKY

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

Trade Compliance

MR754RL Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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