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MJD45H11-001

Onsemi

MJD45H11-001 by Onsemi

MJD45H11-001 by Onsemi is a PNP BJT transistor with 80V VCEO, 8A IC, and 20W power dissipation. Ideal for switching applications, it has a min hFE of 40 and operates up to 150 °C. The package style is in-line with through-hole terminals.

Median Price

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Lifecycle Status

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Vyrian

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Connector Distribution Corp

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Right Parts Inc.

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PC Components Company LLC

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Bristol Electronics

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AZTECH Wire

Italy . 924 parts In-Stock

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Component Stockers USA

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TANS Electronics

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SupplyDigital Components

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Kulean Microsystems

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Problanco Electronics

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A-Z Elektronik GmbH

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Overview

Enhance your power management systems with the MJD45H11-001 by Onsemi, a top-notch Power Bipolar Junction Transistor designed for switching applications. Onsemi's reputation for quality and reliability shines through in this PNP transistor, offering customers unmatched performance and durability. With a maximum collector-emitter voltage of 80V and a maximum collector current of 8A, this transistor is perfect for a wide range of industrial and consumer electronics applications. Trust Onsemi to deliver cutting-edge technology that meets your power needs efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection, making the transistor reliable in various environmental conditions.

Polarity or Channel Type: PNP

PNP transistors are commonly used in high-speed switching applications, making this transistor suitable for fast switching operations.

Configuration: SINGLE

Single configuration simplifies the circuit design and enhances ease of use.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficiency and precision in switching operations.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and space-saving design.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering during assembly.

Maximum Power Dissipation (Abs): 20 W

High power dissipation capacity allows for handling heavy loads and prevents overheating.

Package Style (Meter): IN-LINE

In-line package style offers compatibility with standard mounting techniques and facilitates placement on circuit boards.

Minimum DC Current Gain (hFE): 40

A minimum DC current gain of 40 ensures amplification and stability in transistor operations.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150 °C enables reliable performance in demanding environments.

Maximum Collector-Emitter Voltage: 80 V

High collector-emitter voltage rating provides a wide voltage handling capability, making the transistor versatile in different applications.

Transistor Element Material: SILICON

Silicon material offers high-performance characteristics, ensuring efficient operation and longevity.

Maximum Collector Current (IC): 8 A

With a maximum collector current of 8 A, this transistor can handle heavy current loads, making it suitable for power applications.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and ensures reliable electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and enhances ease of use during installation.

Case Connection: COLLECTOR

Case connection at the collector ensures efficient heat dissipation and contributes to the overall reliability of the transistor.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for a maximum time of 30 seconds at peak reflow temperature, ensuring proper soldering and assembly of the transistor.

Peak Reflow Temperature °C: 235

Peak reflow temperature of 235 °C ensures reliable solder joints and prevents damage during soldering.

Nominal Transition Frequency (fT): 90 MHz

High nominal transition frequency of 90 MHz enables fast switching and amplification, making this transistor suitable for high-frequency applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJD45H11-001 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

80 V

Configuration:

Minimum DC Current Gain (hFE):

40

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJD45H11-001 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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