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MJD41CRLG

Onsemi

MJD41CRLG by Onsemi

MJD41CRLG by Onsemi is a NPN power bipolar junction transistor (BJT) with a max collector-emitter voltage of 100V and a max collector current of 6A. It is commonly used for switching applications due to its high power dissipation of 20W and small outline package style.

Median Price

$0.322

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 8,925 parts In-Stock

1+ parts

$1.200

100+ parts

$0.492

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-

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8,925

$1.200

$0.492

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DigiKey

USA . 4,761 parts In-Stock

1+ parts

$1.200

100+ parts

$0.491

1k+ parts

$0.380

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4,761

$1.200

$0.491

$0.380

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Verical

USA . 7,200 parts In-Stock

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-

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$0.239

7,200

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$0.239

Future Electronics

Canada . 1,800 parts In-Stock

1+ parts

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$0.255

1,800

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$0.255

Rochester

USA . 121 parts In-Stock

1+ parts

-

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$0.322

1k+ parts

$0.268

10k+ parts

$0.238

121

-

$0.322

$0.268

$0.238

Chip1Stop

Japan . 3 parts In-Stock

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3

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$0.405

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-

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500

$0.405

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Digiode

USA . 403 parts In-Stock

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$0.684

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403

$0.684

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IBS Electronics

USA . 39,600 parts In-Stock

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$0.484

39,600

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$0.484

Flip Electronics

USA . 37,800 parts In-Stock

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37,800

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Chip Stock

USA . 27,000 parts In-Stock

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NAC Semi

USA . 3,600 parts In-Stock

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$0.473

3,600

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$0.473

Vyrian

USA . 2,665 parts In-Stock

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2,665

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Rebound Electronics

UK . 1,700 parts In-Stock

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1,700

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Bristol Electronics

USA . 925 parts In-Stock

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925

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Atlantic Semiconductor

USA . 925 parts In-Stock

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925

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Sensible Micro Corp

USA . 355 parts In-Stock

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355

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ComSIT Distribution GmbH

Germany . 53 parts In-Stock

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53

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,805 parts In-Stock

1+ parts

$0.212

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2,805

$0.212

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Semicontronic

India . 2,982 parts In-Stock

1+ parts

$0.225

100+ parts

$0.219

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$0.218

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2,982

$0.225

$0.219

$0.218

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Corohmni

South Africa . 173 parts In-Stock

1+ parts

$0.249

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173

$0.249

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Continental Prestige Electronics

USA . 5,973 parts In-Stock

1+ parts

$0.405

100+ parts

-

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$0.397

5,973

$0.405

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-

$0.397

Argo Parts USA

USA . 416 parts In-Stock

1+ parts

$0.405

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$0.393

416

$0.405

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$0.393

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.462

100+ parts

$0.425

1k+ parts

$0.399

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100

$0.462

$0.425

$0.399

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Corphita

USA . 1,918 parts In-Stock

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$0.648

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1,918

$0.648

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Aztec Data Supply Inc.

USA . 2,637 parts In-Stock

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$1.368

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2,637

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Perfect Parts

USA . 11,010 parts In-Stock

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Problanco Electronics

Mexico . 6,067 parts In-Stock

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SupplyDigital Components

Austria . 5,213 parts In-Stock

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5,213

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TANS Electronics

Latvia . 3,755 parts In-Stock

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Kepictronics

USA . 3,600 parts In-Stock

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3,600

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Kulean Microsystems

USA . 3,362 parts In-Stock

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3,362

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Netroflash

USA . 2,000 parts In-Stock

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$0.397

1k+ parts

$0.385

10k+ parts

$0.377

2,000

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$0.397

$0.385

$0.377

Robosynatics

Brazil . 2,000 parts In-Stock

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2,000

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Lucentia Tech

USA . 2,000 parts In-Stock

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$3.738

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$3.738

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$3.738

2,000

-

$3.738

$3.738

$3.738

UHIMA Technologies

Türkiye . 764 parts In-Stock

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764

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GreenTree Electronics

Israel . 495 parts In-Stock

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495

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Overview

Experience the power and reliability of the MJD41CRLG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and performance. This Power Bipolar Junction Transistor (BJT) is perfect for switching applications, offering seamless functionality and efficiency. With a maximum power dissipation of 20W and a maximum collector current of 6A, this NPN transistor delivers exceptional power capabilities. Its small outline package shape and gull-wing terminal form make it easy to integrate into any project. Trust the MJD41CRLG for all your switching needs and experience the value and benefits it brings to your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it suitable for various operational environments.

Polarity or Channel Type: NPN

The NPN configuration allows for easy integration into most circuit designs and enhances versatility.

Configuration: SINGLE

The single configuration simplifies circuit layout and reduces complexity in design.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring efficient and reliable operation in various electronic systems.

Surface Mount: YES

With surface mount capability, this product provides easy installation and space-saving benefits, making it ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization and easy integration into circuit boards.

Terminal Form: GULL WING

The gull-wing terminal form provides effective soldering and increased mechanical strength, ensuring secure connections.

No. of Elements: 1

With a single element, this transistor offers simplicity and ease of use in circuit integration.

No. of Terminals: 2

The two terminals provide straightforward connectivity, enabling hassle-free integration into a circuit.

Maximum Power Dissipation (Abs): 20 W

This high power dissipation capability ensures stable and efficient performance even under demanding conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for efficient usage of space, making it suitable for compact designs.

Minimum DC Current Gain (hFE): 15

The minimum DC current gain ensures reliable amplification and efficient signal processing.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature enables this product to withstand demanding environments and extended usage without compromising performance.

Maximum Collector-Emitter Voltage: 100 V

With a high maximum collector-emitter voltage, this transistor can handle high voltage applications effectively and safely.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures high performance and reliability.

Maximum Collector Current (IC): 6 A

The high maximum collector current allows for the handling of high current loads with ease and reliability.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability, ensuring reliable and long-lasting connections.

Terminal Position: SINGLE

The single terminal position simplifies circuit integration and offers ease of use in various applications.

Moisture Sensitivity Level (MSL): 1

With MSL level 1, this product is resistant to moisture-related issues, ensuring long-term reliability.

Case Connection: COLLECTOR

The collector case connection design enhances thermal dissipation, enabling efficient heat management.

Maximum Time At Peak Reflow Temperature (s): 30

This transistor can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for effective soldering in various manufacturing processes.

Nominal Transition Frequency (fT): 3 MHz

The nominal transition frequency of 3 MHz enables efficient signal amplification and processing in a wide range of applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJD41CRLG attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

6 A

Maximum Collector-Emitter Voltage:

100 V

Configuration:

Minimum DC Current Gain (hFE):

15

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJD41CRLG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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