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MC74VHCT132AMG

Onsemi

MC74VHCT132AMG by Onsemi

MC74VHCT132AMG by Onsemi is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 11 ns at 5V, making it suitable for industrial applications requiring fast response times. With Schmitt Trigger technology and small outline packaging, it offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,613 parts In-Stock

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Digiode

USA . 731 parts In-Stock

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AZTECH Wire

Italy . 421 parts In-Stock

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TANS Electronics

Latvia . 7,805 parts In-Stock

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SupplyDigital Components

Austria . 6,365 parts In-Stock

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Problanco Electronics

Mexico . 6,175 parts In-Stock

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Microchip USA

USA . 5,964 parts In-Stock

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Kulean Microsystems

USA . 3,804 parts In-Stock

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Corphita

USA . 1,640 parts In-Stock

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UHIMA Technologies

Türkiye . 645 parts In-Stock

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Corohmni

South Africa . 293 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Onsemi with the MC74VHCT132AMG Logic Gates. This versatile component offers high-performance functionality with 4 functions and 2 inputs, making it ideal for a wide range of applications. With a nominal supply voltage of 5V and a propagation delay of just 11ns, this product provides exceptional value and efficiency. Trust Onsemi for cutting-edge technology and superior products that deliver unparalleled results in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the logic gate, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 11 ns

Low propagation delay ensures fast response times for the logic gate, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage: 5V

Operating at a standard 5V supply voltage ensures compatibility with a wide range of electronic systems and components.

Number of Functions: 4

Having multiple functions in one logic gate simplifies circuit design and reduces the need for additional components, saving space and cost.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gate energy efficient and reliable in noisy environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the logic gate can withstand harsh environmental conditions and extended operation without performance degradation.

Technical Specifications

Logic Gates MC74VHCT132AMG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

1.65 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74VHCT132AMG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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