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MC74VHCT132ADR2

Onsemi

MC74VHCT132ADR2 by Onsemi

MC74VHCT132ADR2 by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 11 ns propagation delay. Ideal for industrial applications, it operates at -40 to 85 °C with a supply voltage range of 4.5-5.5 V and features Schmitt Trigger technology for noise immunity.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,837 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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Digiode

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Prism Electronics

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AZTECH Wire

Italy . 159 parts In-Stock

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Microchip USA

USA . 5,449 parts In-Stock

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SupplyDigital Components

Austria . 5,429 parts In-Stock

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Problanco Electronics

Mexico . 3,451 parts In-Stock

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Kulean Microsystems

USA . 3,432 parts In-Stock

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TANS Electronics

Latvia . 3,331 parts In-Stock

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Corphita

USA . 629 parts In-Stock

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Corohmni

South Africa . 211 parts In-Stock

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UHIMA Technologies

Türkiye . 81 parts In-Stock

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Overview

Enhance your electronic projects with the MC74VHCT132ADR2 from Onsemi, a leading manufacturer known for top-quality logic gates. Perfect for a wide range of applications, this versatile component offers customers unmatched value and benefits. With fast propagation delay and low power consumption, this product ensures efficient performance while maintaining high reliability. Upgrade your designs today with the MC74VHCT132ADR2 and experience the difference in quality and functionality that Onsemi is renowned for providing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product easy to handle and robust against external factors.

Propagation Delay At Nominal Supply: 11 ns

Low propagation delay ensures fast signal processing, making the product suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards, saving space and making assembly efficient.

No. of Inputs: 2

Having 2 inputs provides flexibility in circuit design and allows for various logical operations to be performed.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage simplifies compatibility with other components and systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and improving overall circuit performance.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the product can withstand harsh environmental conditions and maintain reliable operation.

Technology: CMOS

CMOS technology allows for low power consumption and high noise immunity, ensuring efficient operation and signal integrity.

Technical Specifications

Logic Gates MC74VHCT132ADR2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

1.65 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC74VHCT132ADR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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