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MC74VHC1GT32DTT1

Onsemi

MC74VHC1GT32DTT1 by Onsemi

MC74VHC1GT32DTT1 by Onsemi is a logic gate with 2 inputs, 10 ns propagation delay, and 15.5 ns tpd. It operates at 3.3/5 V supplies, suitable for military-grade applications requiring fast signal processing in compact spaces. The small outline package with dual terminals and tin-lead finish makes it ideal for high-temp environments up to 125 °C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,037 parts In-Stock

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Digiode

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Lantek

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AZTECH Wire

Italy . 708 parts In-Stock

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$15.970

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Component Stockers USA

USA . 231 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,115 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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Problanco Electronics

Mexico . 3,571 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 497 parts In-Stock

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Microchip USA

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Corphita

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GreenTree Electronics

Israel . 195 parts In-Stock

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Corohmni

South Africa . 175 parts In-Stock

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Türkiye . 150 parts In-Stock

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Overview

Enhance your electronic projects with the MC74VHC1GT32DTT1 by Onsemi, a high-quality logic gate that offers fast propagation delay and reliable performance. As a leading manufacturer in the industry, Onsemi guarantees top-notch products that cater to various applications. With a compact design and low power consumption, this logic gate is perfect for compact electronic devices. Experience seamless integration and improved functionality with the MC74VHC1GT32DTT1, providing exceptional value and benefits to customers seeking efficiency and precision in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body provides durability and protection for the internal components of the logic gates, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay at nominal supply voltage allows for fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability simplifies the assembly process and saves valuable space on PCBs, making it convenient for compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage of 3.3V, making it compatible with a wide range of digital systems and reducing the need for additional voltage regulation.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the logic gates to withstand harsh environmental conditions, ensuring stable performance in various applications.

Technical Specifications

Logic Gates MC74VHC1GT32DTT1 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

15.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.5 mm

Trade Compliance

MC74VHC1GT32DTT1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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