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MC74VHC1GT04P5T5G-L22088

Onsemi

MC74VHC1GT04P5T5G-L22088 by Onsemi

MC74VHC1GT04P5T5G-L22088 by Onsemi is a CMOS Logic Gate with 3V nominal voltage, 14.5ns propagation delay, and 8A max I (ol). Ideal for applications requiring fast signal processing in small outline packages with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,495 parts In-Stock

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7,495

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Digiode

USA . 1,313 parts In-Stock

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1,313

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Distributors (Availability)

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Microchip USA

USA . 9,739 parts In-Stock

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$0.386

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9,739

$0.386

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AZTECH Wire

Italy . 287 parts In-Stock

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$21.690

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287

$21.690

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Kulean Microsystems

USA . 7,568 parts In-Stock

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7,568

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SupplyDigital Components

Austria . 7,370 parts In-Stock

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7,370

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TANS Electronics

Latvia . 6,053 parts In-Stock

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Corphita

USA . 1,782 parts In-Stock

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1,782

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UHIMA Technologies

Türkiye . 985 parts In-Stock

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985

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Problanco Electronics

Mexico . 624 parts In-Stock

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Corohmni

South Africa . 355 parts In-Stock

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Overview

Enhance your electronic designs with the MC74VHC1GT04P5T5G-L22088 logic gate by Onsemi. With a reputation for producing high-quality components, Onsemi delivers reliability and performance in every product. Ideal for a wide range of applications, including signal processing and digital circuits, this logic gate offers customers the value of efficiency, precision, and durability. Upgrade your projects with the superior benefits and advantages that the MC74VHC1GT04P5T5G-L22088 provides, and experience the difference in quality that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product a good choice for various applications.

Surface Mount: YES

Surface mount technology allows for efficient and reliable soldering of the component onto a PCB, saving space and simplifying manufacturing processes.

Nominal Supply Voltage / Vsup (V): 3

Operating at a common supply voltage of 3V makes the product compatible with a wide range of systems and devices.

Propagation Delay (tpd): 14.5 ns

The low propagation delay ensures fast signal processing, making the product suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates MC74VHC1GT04P5T5G-L22088 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-F5

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5/6,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

14.5 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

.8 mm

Trade Compliance

MC74VHC1GT04P5T5G-L22088 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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