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MC74VHC1G86DFT1G

Onsemi

MC74VHC1G86DFT1G by Onsemi

MC74VHC1G86DFT1G by Onsemi is a logic gate with 2 inputs and a propagation delay of 12 ns. It operates at a nominal voltage of 3.3V and can handle a max power supply current of 0.04 mA. This compact, surface mount package is commonly used in military-grade applications requiring fast signal processing.

Median Price

$0.060

Lifecycle Status

EOL

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 798,000 parts In-Stock

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$0.060

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$0.060

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$0.060

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798,000

$0.060

$0.060

$0.060

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Avnet

USA . 15,000 parts In-Stock

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Digiode

USA . 1,689 parts In-Stock

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$0.061

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1,689

$0.061

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Nova Conductors

Japan . 62 parts In-Stock

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$0.076

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62

$0.076

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Bristol Electronics

USA . 328 parts In-Stock

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$0.750

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$0.300

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$0.240

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328

$0.750

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$0.240

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J2 Sourcing AB

Sweden . 11,700 parts In-Stock

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Infinite Electronics LLP

India . 8,924 parts In-Stock

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Vyrian

USA . 2,427 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,050 parts In-Stock

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Holdelec - ElecDif-Pro

France . 2,050 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,629 parts In-Stock

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Cyclops Electronics Ltd

UK . 652 parts In-Stock

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Microfarads

USA . 499 parts In-Stock

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499

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NPI Materials, Inc.

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Corphita

USA . 627 parts In-Stock

1+ parts

$0.058

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627

$0.058

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Corohmni

South Africa . 178 parts In-Stock

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$0.065

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178

$0.065

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Argo Parts USA

USA . 5,132 parts In-Stock

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$0.076

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$0.074

5,132

$0.076

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$0.074

Continental Prestige Electronics

USA . 1,626 parts In-Stock

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$0.076

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$0.074

1,626

$0.076

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$0.074

Netroflash

USA . 500 parts In-Stock

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$0.076

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500

$0.076

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Ampacity Inc.

Singapore . 2,676 parts In-Stock

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$0.120

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2,676

$0.120

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Benley Electronics

USA . 67 parts In-Stock

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$0.300

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67

$0.300

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Microchip USA

USA . 315 parts In-Stock

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$0.494

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315

$0.494

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AZTECH Wire

Italy . 1,218 parts In-Stock

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$16.490

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$16.490

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$24.675

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$22.454

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$20.234

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3,000

$24.675

$22.454

$20.234

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Kepictronics

USA . 306,000 parts In-Stock

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RC Electronics

USA . 149,441 parts In-Stock

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Perfect Parts

USA . 122,093 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Futuretech Components

Singapore . 36,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,593 parts In-Stock

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Lixinc

USA . 13,200 parts In-Stock

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Problanco Electronics

Mexico . 6,887 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,185 parts In-Stock

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TANS Electronics

Latvia . 5,812 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 4,293 parts In-Stock

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SupplyDigital Components

Austria . 3,062 parts In-Stock

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Infinite Electronics LLP (Excess)

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iodParts Technologies Inc.

India . 2,520 parts In-Stock

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2,520

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UHIMA Technologies

Türkiye . 770 parts In-Stock

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770

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Overview

Experience the unbeatable quality and performance of Onsemi with our MC74VHC1G86DFT1G Logic Gates. As a trusted manufacturer, Onsemi delivers superior products that stand out in the market. Our Logic Gates offer a wide range of applications, providing solutions for various industries. With our MC74VHC1G86DFT1G, you can expect exceptional value, benefits, and advantages. Designed with precision and reliability in mind, this product offers seamless integration, high-speed operation, and low power consumption. Unlock new possibilities with Onsemi's MC74VHC1G86DFT1G Logic Gates and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection, making this logic gate suitable for various environments and applications.

Propagation Delay At Nominal Supply: 12 ns

With a fast propagation delay of 12 ns, this logic gate ensures quick signal processing and response times, ideal for time-critical applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation, improving convenience and saving valuable space on a PCB.

No. of Inputs: 2

With two inputs, this logic gate allows for simple and efficient integration within digital circuits, enhancing versatility and functionality.

Package Shape: RECTANGULAR

The rectangular package shape provides compatibility with standard mounting techniques, making it effortless to incorporate into existing circuit designs.

Nominal Supply Voltage (Vsup): 3.3V

Operating at a nominal supply voltage of 3.3V, this logic gate offers compatibility with a wide range of digital systems, ensuring seamless integration and reliable performance.

Load Capacitance (CL): 50 pF

Able to handle a load capacitance of 50 pF, this logic gate is capable of driving capacitive loads without signal degradation, making it suitable for complex circuits.

Power Supplies (V): 2/5.5

With power supply options ranging from 2V to 5.5V, this logic gate can be used in diverse systems, providing flexibility and adaptability to different voltage requirements.

No. of Terminals: 5

Featuring five terminals, this logic gate allows for straightforward connections to other components, facilitating ease of use and reducing wiring complexity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enhances space efficiency and enables high-density circuit designs, making it an excellent choice for compact electronic devices.

Maximum I (ol): 8 Amp

With a maximum output current of 8 Amps, this logic gate can drive high-power loads, accommodating demanding applications with ease.

Propagation Delay (tpd): 19.5 ns

The propagation delay of 19.5 ns ensures reliable and precise signal transmission, helping to maintain signal integrity and minimize data errors.

Maximum Operating Temperature: 125 °C

This logic gate can operate at temperatures up to 125°C, allowing for reliable performance even in high-temperature environments.

Minimum Operating Temperature: -55 °C

Designed to withstand low temperatures as low as -55°C, this logic gate remains operational in harsh cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable electrical connections and long-term durability.

Terminal Position: DUAL

Featuring dual terminal positions, this logic gate offers flexibility in circuit configurations and provides options for optimal signal routing.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this logic gate is suitable for space-constrained applications, offering a compact and low-profile design.

Width: 1.25 mm

With a width of only 1.25 mm, this logic gate is ideal for applications where board space is limited, enabling efficient use of available area.

Minimum Supply Voltage (Vsup): 2V

Operating at a minimum supply voltage of 2V, this logic gate can function in low-power and energy-efficient systems, providing versatility in voltage specifications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this logic gate is suitable for reflow soldering processes, enabling easy and efficient assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of up to 260°C, this logic gate ensures robust solder joints and reliable soldering performance.

Length: 2 mm

Measuring only 2 mm in length, this logic gate offers compact dimensions, making it suitable for miniaturized electronic devices and tight circuit layouts.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this logic gate exhibits enhanced reliability and durability, making it suitable for rugged or demanding environments.

Technology: CMOS

Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this logic gate provides low power consumption, high noise immunity, and wide voltage tolerances, making it an ideal choice for power-sensitive applications.

Terminal Form: GULL WING

With a gull wing terminal form, this logic gate allows for secure and reliable solder joints, ensuring excellent electrical connections and ease of assembly.

Packing Method: TR

Packaged in tape and reel format (TR), this logic gate simplifies automated pick-and-place assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this logic gate enables fine-pitch PCB designs, enabling higher circuit densities and precise signal routing.

Maximum Supply Voltage (Vsup): 5.5V

Capable of operating with a maximum supply voltage of 5.5V, this logic gate offers compatibility with a broad range of digital systems, providing voltage flexibility and wide application suitability.

Maximum Power Supply Current (ICC): 0.04 mA

Drawing a maximum power supply current of 0.04 mA, this logic gate exhibits low power consumption, making it energy-efficient and suitable for power-sensitive electronic systems.

Technical Specifications

Logic Gates MC74VHC1G86DFT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

19.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

MC74VHC1G86DFT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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