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MC74LVX257M

Onsemi

MC74LVX257M by Onsemi

MC74LVX257M by Onsemi is a 4-function, 2-input multiplexer with 13.5ns propagation delay at 3.3V supply. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package style for surface mount applications. The device features a true output polarity and supports a max supply voltage of 3.6V, making it suitable for various digital logic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,240 parts In-Stock

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Digiode

USA . 1,849 parts In-Stock

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AZTECH Wire

Italy . 241 parts In-Stock

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$11.220

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TANS Electronics

Latvia . 8,079 parts In-Stock

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Kulean Microsystems

USA . 7,781 parts In-Stock

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Microchip USA

USA . 4,558 parts In-Stock

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SupplyDigital Components

Austria . 3,355 parts In-Stock

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Problanco Electronics

Mexico . 3,104 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,309 parts In-Stock

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Corphita

USA . 1,364 parts In-Stock

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UHIMA Technologies

Türkiye . 425 parts In-Stock

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Corohmni

South Africa . 406 parts In-Stock

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Overview

Elevate your electronic projects with the MC74LVX257M by Onsemi, a top-quality multiplexer & demultiplexer designed to deliver efficient performance and reliability. Onsemi's reputation for excellence shines through in this product, offering customers a valuable solution for their circuit design needs. With its 4 functions, 2 inputs, and low propagation delay, this versatile component is perfect for a range of applications, from telecommunications to industrial automation. Trust Onsemi to provide cutting-edge technology that meets your demands and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer & demultiplexer, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 13.5 ns

With a low propagation delay, this product offers fast and efficient signal processing, ideal for time-sensitive applications.

Surface Mount: YES

Being surface mountable makes installation and assembly easier, as well as saving space on the PCB.

No. of Functions: 4

Having 4 functions in one device provides versatility and flexibility in designing and implementing different circuit configurations.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a low supply voltage makes this product energy efficient and suitable for low-power applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an excellent choice for digital integrated circuits.

Technical Specifications

Multiplexer & Demultiplexer MC74LVX257M attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LVX257M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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