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MC74LVX157MG

Onsemi

MC74LVX157MG by Onsemi

MC74LVX157MG by Onsemi is a 4-function multiplexer with 2 inputs, operating at 3.3V. It has a propagation delay of 13ns and load capacitance of 50pF. Ideal for industrial applications requiring fast signal switching in compact designs.

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,868 parts In-Stock

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AZTECH Wire

Italy . 209 parts In-Stock

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Component Stockers USA

USA . 687 parts In-Stock

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Kulean Microsystems

USA . 7,781 parts In-Stock

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TANS Electronics

Latvia . 6,201 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

Austria . 2,566 parts In-Stock

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UHIMA Technologies

Türkiye . 916 parts In-Stock

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Corphita

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Microchip USA

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Corohmni

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Overview

Experience seamless and efficient data processing with the MC74LVX157MG by Onsemi, a top-tier manufacturer known for delivering high-quality products in the Multiplexer & Demultiplexer category. This versatile component offers 4 functions and 2 inputs, making it ideal for a wide range of applications. With a low propagation delay and true output polarity, this product ensures quick and accurate data transmission. Trust Onsemi's expertise to provide reliable solutions that enhance performance and reliability in your projects. Choose the MC74LVX157MG for superior quality and unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product long-lasting.

Propagation Delay At Nominal Supply: 13 ns

Low propagation delay ensures fast and accurate data transmission, making the product suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components, enhancing efficiency and reducing costs.

No. of Inputs: 2

Having multiple inputs allows for versatile connectivity options, making the product compatible with various systems and configurations.

Nominal Supply Voltage / Vsup (V): 2.7

Operates at a low voltage, offering energy efficiency and compatibility with a wide range of power sources.

Load Capacitance (CL): 50 pF

Designed to work with a specific load capacitance, ensuring optimal performance and reliability in the intended applications.

Power Supplies (V): 3.3

Compatible with standard power supplies, making integration and operation straightforward and convenient.

No. of Terminals: 16

Sufficient number of terminals for versatile connectivity options and easy installation in circuit layouts.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space and allows for dense packing of components on circuit boards.

Maximum I (ol): 4 Amp

High output current capability allows for driving of larger loads, making the product suitable for a variety of applications.

Propagation Delay (tpd): 19 ns

Low propagation delay ensures fast signal transmission, reducing latency and improving overall system performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures ensures product functionality in extreme hot or cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish provides corrosion resistance and ensures stable electrical connections for long-term reliability.

Terminal Position: DUAL

Dual terminal position provides flexibility for installation and allows for multiple orientation options on circuit boards.

Maximum Seated Height: 2.05 mm

Low seated height allows for compact design and minimizes interference with neighboring components.

Width: 5.275 mm

Narrow width allows for space-saving installation in crowded PCB layouts or tight enclosures.

Output Polarity: TRUE

True output polarity ensures correct signal interpretation and compatibility with other components in the system.

Minimum Supply Voltage (Vsup): 2 V

Operates at a low minimum supply voltage, enabling flexibility in power source selection and energy-efficient operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering during manufacturing processes.

Length: 10.2 mm

Compact length allows for efficient use of space on circuit boards and in product designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds for efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy soldering during assembly, ensuring robust electrical connections.

Packing Method: RAIL

Rail packing method facilitates automated assembly processes and protects the product during shipping and handling.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration into existing PCB layouts and compatibility with common connector types.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage tolerance accommodates a wide range of power sources and operation in diverse settings.

Technical Specifications

Multiplexer & Demultiplexer MC74LVX157MG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LVX157MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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