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MC74LCX158MG

Onsemi

MC74LCX158MG by Onsemi

MC74LCX158MG by Onsemi is a 4:1 multiplexer with 2 inputs, 6.5 ns propagation delay, and 50 pF load capacitance. It operates at a supply voltage of 2.7-3.6V and has a max operating temperature of 85 °C. Ideal for industrial applications requiring fast signal switching in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,783 parts In-Stock

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Digiode

USA . 419 parts In-Stock

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AZTECH Wire

Italy . 347 parts In-Stock

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$18.820

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Component Stockers USA

USA . 761 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 16,812 parts In-Stock

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SupplyDigital Components

Austria . 7,930 parts In-Stock

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Microchip USA

USA . 3,380 parts In-Stock

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TANS Electronics

Latvia . 3,208 parts In-Stock

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Corphita

USA . 2,000 parts In-Stock

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Problanco Electronics

Mexico . 1,100 parts In-Stock

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Kulean Microsystems

USA . 620 parts In-Stock

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UHIMA Technologies

Türkiye . 376 parts In-Stock

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Corohmni

South Africa . 304 parts In-Stock

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Overview

Enhance your electronic projects with the MC74LCX158MG multiplexer by Onsemi. Crafted with precision and cutting-edge technology, this versatile component offers seamless integration and superior performance. Ideal for a wide range of applications in industries such as telecommunications, automotive, and consumer electronics, this multiplexer provides unmatched reliability and efficiency. Trust Onsemi's reputation for quality and innovation, and elevate your designs with the MC74LCX158MG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection for the components inside, making the product durable and long-lasting.

Propagation Delay At Nominal Supply: 6.5 ns

Low propagation delay ensures fast data transmission, making this product suitable for applications where speed is crucial.

Surface Mount: YES

Surface mount capability simplifies the assembly process, making it easier to integrate this product into electronic circuits.

No. of Functions: 4

Having 4 functions in one device reduces the need for multiple components, saving space and cost in the overall circuit design.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V provides energy efficiency, making this product suitable for battery-powered devices.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can efficiently handle capacitance loads in electronic circuits, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

The wide temperature range of up to 85 °C allows this product to operate reliably in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noise-prone environments.

Technical Specifications

Multiplexer & Demultiplexer MC74LCX158MG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LCX158MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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