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MC74LCX07DR2

Onsemi

MC74LCX07DR2 by Onsemi

MC74LCX07DR2 by Onsemi is a Logic Gates IC with 6 functions, 3ns propagation delay at 2.5V, and open-drain output. Ideal for industrial applications, it operates b/w -40 to 85 °C with a max supply voltage of 5.5V in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,296 parts In-Stock

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Digiode

USA . 1,664 parts In-Stock

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AZTECH Wire

Italy . 370 parts In-Stock

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$20.540

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370

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QUARKTWIN TECHNOLOGY LTD

USA . 29,256 parts In-Stock

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SupplyDigital Components

Austria . 7,309 parts In-Stock

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Kulean Microsystems

USA . 5,588 parts In-Stock

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TANS Electronics

Latvia . 3,498 parts In-Stock

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Corphita

USA . 1,365 parts In-Stock

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Problanco Electronics

Mexico . 1,049 parts In-Stock

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Microchip USA

USA . 260 parts In-Stock

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UHIMA Technologies

Türkiye . 241 parts In-Stock

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Corohmni

South Africa . 234 parts In-Stock

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Overview

Discover the cutting-edge MC74LCX07DR2 logic gates by Onsemi, known for their exceptional quality and reliability. These versatile components offer lightning-fast propagation delay of just 3 ns, making them ideal for a wide range of applications. From industrial automation to consumer electronics, these logic gates deliver superior performance and efficiency. Trust Onsemi's reputation for excellence and choose the MC74LCX07DR2 for all your logic gate needs. Unlock the potential of your projects with this top-of-the-line product that offers unparalleled value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 3 ns

The low propagation delay ensures fast and efficient signal processing, making the product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable provides easy installation and saves space on the PCB, contributing to a more compact design.

Nominal Supply Voltage / Vsup (V): 2.5

The low nominal supply voltage requirement makes the product energy-efficient and helps in reducing power consumption.

Output Characteristics: OPEN-DRAIN

The open-drain output configuration allows for flexible interfacing with other devices and can be used for wired-OR applications.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of supply voltages, making the product versatile and efficient.

Technical Specifications

Logic Gates MC74LCX07DR2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC74LCX07DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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