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MC74LCX02DG

Onsemi

MC74LCX02DG by Onsemi

MC74LCX02DG by Onsemi is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 5.5 ns at 2.5V, making it suitable for industrial applications requiring fast signal processing in a small outline package. With a max operating temperature of 85°C and low power consumption, it is ideal for high-speed digital circuits.

Median Price

$0.238

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 95 parts In-Stock

1+ parts

$0.540

100+ parts

$0.310

1k+ parts

-

10k+ parts

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95

$0.540

$0.310

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-

Rochester

USA . 56,060 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

56,060

-

$0.238

$0.197

$0.176

Flip Electronics (Authorized)

USA . 41,680 parts In-Stock

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41,680

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Verical

USA . 27,820 parts In-Stock

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$0.220

27,820

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-

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$0.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 201 parts In-Stock

1+ parts

$0.147

100+ parts

-

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201

$0.147

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Flip Electronics

USA . 41,680 parts In-Stock

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-

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41,680

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Vyrian

USA . 3,823 parts In-Stock

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3,823

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TME

Poland . 7 parts In-Stock

1+ parts

-

100+ parts

$0.262

1k+ parts

$0.131

10k+ parts

-

7

-

$0.262

$0.131

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LWI Electronics Inc

India . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,174 parts In-Stock

1+ parts

$0.140

100+ parts

-

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1,174

$0.140

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Corohmni

South Africa . 435 parts In-Stock

1+ parts

$0.155

100+ parts

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435

$0.155

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Microchip USA

USA . 319 parts In-Stock

1+ parts

$4.030

100+ parts

$4.010

1k+ parts

$3.990

10k+ parts

$3.980

319

$4.030

$4.010

$3.990

$3.980

Continental Prestige Electronics

USA . 56,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.174

10k+ parts

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56,310

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$0.174

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QUARKTWIN TECHNOLOGY LTD

USA . 8,739 parts In-Stock

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8,739

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TANS Electronics

Latvia . 6,828 parts In-Stock

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6,828

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Perfect Parts

USA . 5,742 parts In-Stock

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5,742

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 4,163 parts In-Stock

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4,163

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Kulean Microsystems

USA . 1,173 parts In-Stock

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1,173

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SupplyDigital Components

Austria . 545 parts In-Stock

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545

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UHIMA Technologies

Türkiye . 513 parts In-Stock

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513

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Overview

Unleash the power of reliable logic gates with the MC74LCX02DG by Onsemi. This high-quality product offers customers a seamless experience with its cutting-edge technology and industrial-grade design. Perfect for a wide range of applications, this logic gate boasts fast propagation delays and low power consumption, making it a cost-effective and efficient solution for your electronic projects. Trust Onsemi to deliver top-notch performance and unmatched value with the MC74LCX02DG.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures fast response time, making this product suitable for applications requiring high speed performance.

No. of Functions: 4

Having multiple functions in one package reduces the overall component count in a design, saving space and simplifying the circuit layout.

Nominal Supply Voltage: 2.5V

Operating at a low supply voltage allows for lower power consumption, making this product energy efficient.

Maximum Operating Temperature: 85°C

With a high operating temperature range, this product is suitable for industrial applications where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers high noise immunity and low power consumption, making this product reliable and energy efficient.

Technical Specifications

Logic Gates MC74LCX02DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

MC74LCX02DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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