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MC74HC1G32DTT1G

Onsemi

MC74HC1G32DTT1G by Onsemi

MC74HC1G32DTT1G by Onsemi is a logic gate with 2 inputs and a propagation delay of 90 ns. It operates at a nominal voltage of 3V and has a max operating temperature of 125°C. This compact device is commonly used in military applications due to its small size and CMOS technology.

Median Price

$0.072

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 3,000 parts In-Stock

1+ parts

$0.075

100+ parts

$0.071

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$0.064

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$0.075

$0.071

$0.064

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Arrow

USA . 3,000 parts In-Stock

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$0.069

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$0.069

Verical

USA . 3,000 parts In-Stock

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$0.069

3,000

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$0.069

Chip1Stop

Japan . 2,515 parts In-Stock

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$0.103

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$0.081

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$0.077

2,515

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$0.081

$0.077

Distributors (In-Stock)

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Digiode

USA . 414 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Component Electronics Inc.

Canada . 1,556 parts In-Stock

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$1.150

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$0.870

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$0.750

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1,556

$1.150

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Flip Electronics

USA . 321,000 parts In-Stock

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Chip Stock

USA . 30,500 parts In-Stock

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Vyrian

USA . 8,613 parts In-Stock

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Cogito LLC

Ukraine . 3,010 parts In-Stock

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Semtec, LLC

USA . 2,960 parts In-Stock

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Bristol Electronics

USA . 987 parts In-Stock

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Cyclops Electronics Ltd

UK . 978 parts In-Stock

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Sensible Micro Corp

USA . 845 parts In-Stock

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ComSIT Distribution GmbH

Germany . 147 parts In-Stock

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ComSIT USA

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Prism Electronics

USA . 84 parts In-Stock

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LWI Electronics Inc

India . 55 parts In-Stock

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TME

Poland . 15 parts In-Stock

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$0.123

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$0.092

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$0.072

15

-

$0.123

$0.092

$0.072

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 18,034 parts In-Stock

1+ parts

$0.020

100+ parts

$0.070

1k+ parts

$0.070

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$0.060

18,034

$0.020

$0.070

$0.070

$0.060

Semicontronic

India . 1,929 parts In-Stock

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$0.059

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$0.058

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$0.057

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1,929

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$0.057

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Ampacity Inc.

Singapore . 1,808 parts In-Stock

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$0.059

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Corphita

USA . 1,434 parts In-Stock

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$0.068

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Corohmni

South Africa . 175 parts In-Stock

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$0.069

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Argo Parts USA

USA . 1,710 parts In-Stock

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$0.110

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$0.107

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Netroflash

USA . 500 parts In-Stock

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$0.112

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$0.106

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$0.104

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$0.112

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$0.104

AZTECH Wire

Italy . 900 parts In-Stock

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$15.510

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Aztec Data Supply Inc.

USA . 2,967 parts In-Stock

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$22.907

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Kepictronics

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Perfect Parts

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RC Electronics

USA . 98,768 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 5,624 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,856 parts In-Stock

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TANS Electronics

Latvia . 4,668 parts In-Stock

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Kulean Microsystems

USA . 4,475 parts In-Stock

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GreenTree Electronics

Israel . 4,321 parts In-Stock

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Continental Prestige Electronics

USA . 3,425 parts In-Stock

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$0.147

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$0.094

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Problanco Electronics

Mexico . 1,614 parts In-Stock

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Assy Fe

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UHIMA Technologies

Türkiye . 287 parts In-Stock

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Lixinc

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Overview

Discover the MC74HC1G32DTT1G by Onsemi, a high-quality logic gate that offers exceptional performance and reliability. Onsemi, a renowned manufacturer in the industry, ensures top-notch craftsmanship and precision engineering with every product. As part of the logic gates category, this versatile device finds applications in various industries, providing efficient signal processing solutions. With its compact design and surface mount capability, it offers convenience and ease of use. Experience the value of fast propagation delay, low power consumption, and wide operating temperature range that the MC74HC1G32DTT1G delivers. Get ready to elevate your projects with this remarkable product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material in the package body makes the product lightweight and durable, making it suitable for various applications.

Propagation Delay At Nominal Supply: 90 ns

The low propagation delay of 90 ns ensures fast and efficient operation of the logic gates, making them ideal for time-sensitive applications.

Surface Mount: YES

The surface mount feature allows for easy and compact installation of the logic gates on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup: 3V

The compatibility with a nominal supply voltage of 3V makes the logic gates suitable for a wide range of electronic devices operating within this voltage range.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the logic gates can withstand harsh environmental conditions and offer reliable performance in demanding applications.

Technology: CMOS

The CMOS technology used in the logic gates provides low power consumption and high noise immunity, making them energy-efficient and reliable for various digital logic applications.

Technical Specifications

Logic Gates MC74HC1G32DTT1G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2.6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

90 ns

Propagation Delay (tpd):

155 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

MC74HC1G32DTT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-646-6392, 5962016466392

NIIN

016466392

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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