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MC74HC04ANG

Onsemi

MC74HC04ANG by Onsemi

MC74HC04ANG by Onsemi is a CMOS Logic Gates IC with 6 functions, 22ns propagation delay at 3V. It has a max operating temperature of 125°C and is ideal for military-grade applications requiring fast signal processing in a through-hole package.

Median Price

$0.480

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 73 parts In-Stock

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$0.254

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73

$0.254

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DF Sales Co.

USA . 18 parts In-Stock

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$0.480

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$0.480

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DF Sales Co.

USA . 18 parts In-Stock

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$0.480

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$0.480

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Component Electronics Inc.

Canada . 2 parts In-Stock

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$1.540

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$1.150

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$1.000

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2

$1.540

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Vyrian

USA . 3,196 parts In-Stock

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Digiode

USA . 1,656 parts In-Stock

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Velocity Electronics

USA . 840 parts In-Stock

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Sensible Micro Corp

USA . 22 parts In-Stock

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$1.199

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$1.107

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22

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NAC Semi

USA . 6 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,509 parts In-Stock

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$0.254

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$0.249

4,509

$0.254

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$0.249

Argo Parts USA

USA . 2,068 parts In-Stock

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$0.254

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$0.246

2,068

$0.254

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$0.246

Netroflash

USA . 1,000 parts In-Stock

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$0.254

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1,000

$0.254

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Corohmni

South Africa . 162 parts In-Stock

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$0.480

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162

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Ampacity Inc.

Singapore . 1,613 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 348 parts In-Stock

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$10.104

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Semicontronic

India . 1,381 parts In-Stock

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$13.000

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$12.675

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$12.610

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1,381

$13.000

$12.675

$12.610

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$26.209

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$24.899

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$24.899

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870

$26.209

$24.899

$24.899

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Aztec Data Supply Inc.

USA . 4,250 parts In-Stock

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$31.540

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Problanco Electronics

Mexico . 6,323 parts In-Stock

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SupplyDigital Components

Austria . 5,541 parts In-Stock

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Kulean Microsystems

USA . 4,479 parts In-Stock

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RC Electronics

USA . 2,400 parts In-Stock

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Corphita

USA . 1,812 parts In-Stock

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TANS Electronics

Latvia . 991 parts In-Stock

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UHIMA Technologies

Türkiye . 421 parts In-Stock

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Microchip USA

USA . 242 parts In-Stock

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Overview

Unlock the power of seamless logic operations with the MC74HC04ANG by Onsemi. Manufactured with precision and expertise, this logic gate offers unparalleled performance and reliability for a wide range of applications. Whether you're in need of fast propagation delay or high load capacitance, this product delivers it all with ease. With Onsemi's trusted name behind it, you can trust that you're getting a top-quality product that will meet and exceed your expectations. Upgrade your projects today with the MC74HC04ANG and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this product lightweight and durable, perfect for various electronic applications.

Propagation Delay At Nominal Supply: 22 ns

With a fast propagation delay of 22 ns, this logic gate ensures quick signal processing, ideal for high-speed applications.

No. of Functions: 6

Having 6 functions in one unit allows for space-saving and efficient circuit design, making it a versatile choice for complex projects.

Package Shape: RECTANGULAR

The rectangular shape of the package provides ease of handling and integration into circuit boards, ensuring a seamless installation process.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V, this logic gate offers a good balance between performance and power efficiency.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can effectively drive capacitive loads, making it suitable for a wide range of applications.

Power Supplies (V): 2/6

Compatible with power supplies ranging from 2V to 6V, this logic gate offers flexibility in power requirements, making it adaptable to various systems.

No. of Terminals: 14

With 14 terminals, this logic gate provides ample connection options for interfacing with other components, allowing for versatile circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style saves space on the circuit board and simplifies PCB layout, contributing to a more organized and efficient design.

Maximum I (ol): 4 Amp

With a maximum output current of 4A, this logic gate can drive high-power loads, making it suitable for demanding applications.

Propagation Delay (tpd): 110 ns

While the propagation delay of 110 ns may be slightly higher, this product still offers reliable performance for most standard applications.

Maximum Operating Temperature: 125 °C

Operating efficiently up to 125°C, this logic gate is suitable for use in extreme temperature conditions, ensuring reliability in various environments.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product can withstand cold temperatures, making it suitable for outdoor or industrial applications.

Terminal Finish: Tin (Sn)

The tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection for long-term use.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and allows for easy connection to other components, facilitating a streamlined assembly process.

Maximum Seated Height: 4.69 mm

With a low seated height of 4.69 mm, this logic gate is suitable for compact designs where space is limited, making it a versatile choice for small electronic devices.

Width: 7.62 mm

The 7.62 mm width of this product provides a compact footprint, ideal for applications where board space is limited.

Minimum Supply Voltage (Vsup): 2 V

Operating at a minimum supply voltage of 2V ensures compatibility with low-power systems, making this logic gate an energy-efficient choice.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can undergo solder reflow processes without compromising its performance, ensuring reliable assembly.

Length: 18.86 mm

The 18.86 mm length of this logic gate offers a balanced form factor, suitable for various PCB layouts and installations.

Temperature Grade: MILITARY

Designed for military-grade applications, this logic gate meets stringent quality and reliability standards, making it a dependable choice for mission-critical systems.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption and high noise immunity, making it suitable for battery-powered devices and noise-sensitive applications.

Terminal Form: THROUGH-HOLE

With a through-hole terminal form, this product provides a secure and robust electrical connection, ideal for applications subject to vibrations or mechanical stress.

Packing Method: RAIL

Packaged in a rail format, this logic gate is convenient for bulk production and automated assembly processes, ensuring efficient manufacturing.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy connections on standard PCB grids, simplifying the assembly and maintenance of electronic circuits.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this logic gate can accommodate higher voltage requirements, making it suitable for a wide range of industrial and automotive applications.

Technical Specifications

Logic Gates MC74HC04ANG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC74HC04ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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