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MC74HC00AFG

Onsemi

MC74HC00AFG by Onsemi

MC74HC00AFG by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 22ns propagation delay. Operating b/w -55 to 125 °C, it has a supply voltage range of 2-6V. Ideal for applications requiring fast signal processing in military-grade environments.

Median Price

$0.379

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,395 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

$0.296

10k+ parts

$0.264

22,395

-

$0.357

$0.296

$0.264

Verical

USA . 7,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.401

10k+ parts

$0.330

7,805

-

-

$0.401

$0.330

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,478 parts In-Stock

1+ parts

$0.277

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2,478

$0.277

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Vyrian

USA . 6,075 parts In-Stock

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6,075

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Distributors (Availability)

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Corphita

USA . 567 parts In-Stock

1+ parts

$0.263

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567

$0.263

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Corohmni

South Africa . 83 parts In-Stock

1+ parts

$0.292

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-

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83

$0.292

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AZTECH Wire

Italy . 513 parts In-Stock

1+ parts

$20.440

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513

$20.440

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-

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Continental Prestige Electronics

USA . 22,395 parts In-Stock

1+ parts

-

100+ parts

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$0.254

10k+ parts

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22,395

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-

$0.254

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SupplyDigital Components

Austria . 6,657 parts In-Stock

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6,657

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Kulean Microsystems

USA . 5,550 parts In-Stock

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5,550

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Problanco Electronics

Mexico . 4,893 parts In-Stock

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TANS Electronics

Latvia . 2,501 parts In-Stock

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Perfect Parts

USA . 743 parts In-Stock

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743

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Microchip USA

USA . 471 parts In-Stock

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471

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UHIMA Technologies

Türkiye . 153 parts In-Stock

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153

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Overview

Unlock the power of seamless logic operations with the MC74HC00AFG by Onsemi. Crafted with precision and expertise, this logic gate delivers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile component offers fast propagation delays and low power consumption, making it an ideal choice for demanding projects. Trust in Onsemi's legacy of excellence and invest in the value and quality that the MC74HC00AFG brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and reliability.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast operation of the logic gates, making them suitable for time-critical applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

No. of Functions: 4

Having multiple functions in one component simplifies circuit design and reduces the total number of components needed.

No. of Inputs: 2

With 2 inputs, this logic gate can perform basic logical operations efficiently.

Nominal Supply Voltage / Vsup (V): 3

Operating at a voltage of 3V makes this product suitable for low-power applications.

Load Capacitance (CL): 50 pF

Having a known load capacitance helps designers calculate necessary drive strength and ensures proper signal integrity.

Power Supplies (V): 2/6

Compatible with power supplies ranging from 2V to 6V, providing flexibility in different circuit configurations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and wide supply voltage range, making these logic gates versatile and efficient.

Maximum Seated Height: 2.05 mm

Compact size enables integration into small spaces and low-profile applications.

Technical Specifications

Logic Gates MC74HC00AFG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74HC00AFG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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