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MC74ACT132MELG

Onsemi

MC74ACT132MELG by Onsemi

MC74ACT132MELG by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 13ns at 5V, suitable for industrial applications requiring Schmitt Trigger technology. The package is small outline, surface mountable, with nickel palladium gold terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,642 parts In-Stock

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Digiode

USA . 1,313 parts In-Stock

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AZTECH Wire

Italy . 269 parts In-Stock

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$8.300

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Component Stockers USA

USA . 688 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 7,723 parts In-Stock

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TANS Electronics

Latvia . 3,298 parts In-Stock

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SupplyDigital Components

Austria . 2,052 parts In-Stock

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Corphita

USA . 1,417 parts In-Stock

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Problanco Electronics

Mexico . 1,408 parts In-Stock

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Corohmni

South Africa . 468 parts In-Stock

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Microchip USA

USA . 242 parts In-Stock

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UHIMA Technologies

Türkiye . 162 parts In-Stock

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Overview

Elevate your projects with the MC74ACT132MELG by Onsemi, a high-quality logic gate that delivers exceptional performance and reliability. Designed by the trusted manufacturer Onsemi, this versatile component offers 4 functions, 2 inputs, and a fast propagation delay of just 13ns, making it ideal for a wide range of industrial applications. With a compact small outline package and dual-terminal position, this logic gate is easy to integrate into any design. Trust Onsemi for top-notch quality and efficiency in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Propagation Delay At Nominal Supply: 13 ns

With a fast propagation delay of 13 ns, this logic gate ensures quick response times, making it efficient for time-sensitive operations.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 4

Having 4 functions in one package increases the versatility and functionality of the logic gate, providing more input/output options.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard voltage levels in electronic systems, making integration easier.

Schmitt Trigger: YES

The presence of a Schmitt trigger ensures signal conditioning and noise immunity, improving the reliability and stability of the logic gate's operations.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the overall system.

Technical Specifications

Logic Gates MC74ACT132MELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74ACT132MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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