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MC74AC86NG

Onsemi

MC74AC86NG by Onsemi

MC74AC86NG by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 12.5 ns propagation delay at 5V. Ideal for industrial applications requiring fast signal processing in a compact IN-LINE package with TIN finish and dual terminals.

Median Price

$0.386

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 581 parts In-Stock

1+ parts

$1.540

100+ parts

$0.087

1k+ parts

$0.074

10k+ parts

-

581

$1.540

$0.087

$0.074

-

Rochester

USA . 1,075 parts In-Stock

1+ parts

-

100+ parts

$0.343

1k+ parts

$0.285

10k+ parts

$0.254

1,075

-

$0.343

$0.285

$0.254

Verical

USA . 1,075 parts In-Stock

1+ parts

-

100+ parts

-

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$0.386

10k+ parts

$0.318

1,075

-

-

$0.386

$0.318

Distributors (In-Stock)

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Digiode

USA . 1,611 parts In-Stock

1+ parts

$0.268

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1,611

$0.268

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Vyrian

USA . 7,661 parts In-Stock

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7,661

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DigiKey Marketplace

USA . 1,075 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 437 parts In-Stock

1+ parts

$0.240

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437

$0.240

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Corphita

USA . 299 parts In-Stock

1+ parts

$0.254

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299

$0.254

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Corohmni

South Africa . 432 parts In-Stock

1+ parts

$0.282

100+ parts

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432

$0.282

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AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$20.950

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752

$20.950

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QUARKTWIN TECHNOLOGY LTD

USA . 24,850 parts In-Stock

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24,850

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TANS Electronics

Latvia . 7,984 parts In-Stock

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Problanco Electronics

Mexico . 7,475 parts In-Stock

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Perfect Parts

USA . 6,620 parts In-Stock

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SupplyDigital Components

Austria . 4,675 parts In-Stock

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Microchip USA

USA . 4,333 parts In-Stock

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Kulean Microsystems

USA . 1,110 parts In-Stock

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GreenTree Electronics

Israel . 619 parts In-Stock

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619

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Authorized Procurement Solutions

USA . 619 parts In-Stock

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619

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UHIMA Technologies

Türkiye . 479 parts In-Stock

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479

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Overview

Enhance your electronic projects with the MC74AC86NG logic gates from Onsemi, a trusted manufacturer known for quality and reliability. With 4 functions and 2 inputs, this versatile component offers a fast propagation delay of 12.5 ns, making it ideal for a wide range of applications. Whether you're designing circuits for industrial automation or consumer electronics, this logic gate delivers exceptional performance at a competitive price point. Upgrade your projects today with the MC74AC86NG and experience the value and benefits of using top-notch components from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 12.5 ns

The low propagation delay enables fast processing of signals, making the logic gates suitable for high-speed operations.

No. of Functions: 4

Having multiple functions in a single logic gate allows for complex logic operations to be performed efficiently in a compact design.

No. of Inputs: 2

With 2 inputs, the logic gates can perform basic logic operations effectively, making them versatile for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with standard electronic systems, making integration easier.

Load Capacitance (CL): 50 pF

The low load capacitance allows for efficient operation with minimal power consumption and heat generation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environments or during prolonged use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the logic gates to function in a wide range of temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates MC74AC86NG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

12.5 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC74AC86NG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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