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MC14093BFELG

Onsemi

MC14093BFELG by Onsemi

MC14093BFELG by Onsemi is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 250 ns and operates at a nominal voltage of 5V. This small outline package is suitable for military applications.

Median Price

$0.264

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 95 parts In-Stock

1+ parts

-

100+ parts

$0.264

1k+ parts

$0.219

10k+ parts

$0.196

95

-

$0.264

$0.219

$0.196

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.193

100+ parts

-

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300

$0.193

-

-

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Digiode

USA . 649 parts In-Stock

1+ parts

$0.206

100+ parts

-

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649

$0.206

-

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Vyrian

USA . 6,901 parts In-Stock

1+ parts

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6,901

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 95 parts In-Stock

1+ parts

$0.184

100+ parts

-

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95

$0.184

-

-

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.190

100+ parts

-

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$0.182

10k+ parts

-

50

$0.190

-

$0.182

-

Corphita

USA . 2,092 parts In-Stock

1+ parts

$0.195

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-

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2,092

$0.195

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Corohmni

South Africa . 141 parts In-Stock

1+ parts

$0.217

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141

$0.217

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Component Stockers USA

USA . 115 parts In-Stock

1+ parts

$0.220

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115

$0.220

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AZTECH Wire

Italy . 312 parts In-Stock

1+ parts

$9.115

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312

$9.115

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Kulean Microsystems

USA . 8,244 parts In-Stock

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TANS Electronics

Latvia . 7,182 parts In-Stock

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Microchip USA

USA . 5,091 parts In-Stock

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5,091

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SupplyDigital Components

Austria . 4,826 parts In-Stock

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Perfect Parts

USA . 4,446 parts In-Stock

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4,446

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Problanco Electronics

Mexico . 3,376 parts In-Stock

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Kepictronics

USA . 1,740 parts In-Stock

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1,740

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UHIMA Technologies

Türkiye . 425 parts In-Stock

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425

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Overview

Discover the MC14093BFELG by Onsemi, a high-quality logic gate that guarantees superior performance and reliability. As a leading manufacturer in the industry, Onsemi is known for its cutting-edge technology and innovative solutions. The MC14093BFELG offers numerous advantages, including a small outline package shape, surface mount capability, and a wide operating temperature range. With four functions and two inputs, this logic gate is perfect for a variety of applications. Benefit from its low propagation delay, precise voltage control, and excellent resistance to environmental factors. Choose the MC14093BFELG for unmatched value and enjoy seamless integration into your circuit designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it suitable for various applications.

Propagation Delay At Nominal Supply: 250 ns

This low delay allows for fast signal processing, ensuring efficient performance in time-sensitive applications.

Surface Mount: YES

The surface mount capability enables easy integration onto circuit boards, simplifying the assembly process and saving valuable space.

No. of Functions: 4

With multiple functions packed into a single device, this product offers versatility and cost-effectiveness.

No. of Inputs: 2

The two input configuration allows for simple logic operations, making it suitable for basic circuit designs.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy placement and alignment on circuit boards, enhancing installation efficiency.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage level ensures compatibility with commonly used power sources.

Load Capacitance (CL): 50 pF

This low capacitance value minimizes the impact of external components on the circuit, resulting in more stable and reliable signal transmission.

Power Supplies (V): 5/15

The ability to operate with multiple voltage supplies provides flexibility in different system configurations.

No. of Terminals: 14

The generous number of terminals enables connections to various components, expanding the product's application range.

Package Style (Meter): SMALL OUTLINE

The small outline package offers a compact and space-saving solution for circuits where size constraints are critical.

Propagation Delay (tpd): 250 ns

The consistent propagation delay ensures accurate timing and synchronization of signals, enhancing overall system performance.

Maximum Operating Temperature: 125 °C

Operating within this high-temperature range allows the product to withstand harsh environmental conditions and maintain its functionality.

Minimum Operating Temperature: -55 °C

This wide temperature range ensures reliable operation even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and promotes reliable electrical connections.

Terminal Position: DUAL

The dual terminal position allows for flexible and convenient wiring setups, facilitating customization for different applications.

Maximum Seated Height: 2.05 mm

The low seated height allows for efficient space utilization, especially in compact electronic devices.

Width: 5.275 mm

The narrow width enables close placement of multiple devices, optimizing circuit density and layout efficiency.

Minimum Supply Voltage (Vsup): 3 V

The ability to operate at low voltages provides energy-saving benefits and compatibility with low-power systems.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the device can withstand the required reflow soldering process without compromising its functionality.

Peak Reflow Temperature °C: 260

The peak reflow temperature indicates the product's durability during soldering, enhancing its reliability in manufacturing processes.

Length: 10.2 mm

The product's length allows for easy alignment and secure attachment to circuit boards, ensuring proper electrical connections.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the product's ability to operate reliably in demanding and rugged environments.

Schmitt Trigger: YES

The presence of a Schmitt trigger enables noise immunity and signal conditioning, enhancing the product's robustness and noise tolerance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and wide operating voltage range, making this product a suitable choice for various applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and provides mechanical stability, ensuring secure connections.

Packing Method: TR

The packaging method ensures convenient handling, protection, and organization of the devices during shipping and storage.

Terminal Pitch: 1.27 mm

The small terminal pitch enables precise connections and compatibility with standard PCB layouts, enhancing ease of integration.

Moisture Sensitivity Level (MSL): 3

This moisture sensitivity level indicates the product's ability to withstand moisture exposure during handling and storage.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage allows for compatibility with power sources operating at higher voltage levels.

Technical Specifications

Logic Gates MC14093BFELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Trade Compliance

MC14093BFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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