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MC14070BFELG

Onsemi

MC14070BFELG by Onsemi

MC14070BFELG by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at a supply voltage range of 3-18V, with a propagation delay of 350ns. Suitable for military-grade applications due to its wide temperature range and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 11,435 parts In-Stock

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Digiode

USA . 402 parts In-Stock

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AZTECH Wire

Italy . 1,140 parts In-Stock

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$10.560

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Problanco Electronics

Mexico . 5,965 parts In-Stock

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Microchip USA

USA . 5,133 parts In-Stock

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Corphita

USA . 2,166 parts In-Stock

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TANS Electronics

Latvia . 1,932 parts In-Stock

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Kulean Microsystems

USA . 1,208 parts In-Stock

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UHIMA Technologies

Türkiye . 971 parts In-Stock

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SupplyDigital Components

Austria . 807 parts In-Stock

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Corohmni

South Africa . 352 parts In-Stock

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Overview

Elevate your electronic projects with the MC14070BFELG by Onsemi, a top-of-the-line logic gates component that guarantees exceptional quality and reliability. Manufactured by industry leader Onsemi, this product boasts superior performance and versatility, making it an essential addition to any circuit design. Whether you're working on consumer electronics, automotive systems, or industrial applications, this logic gate is sure to meet your needs with its efficient operation and advanced features. Trust Onsemi to deliver cutting-edge technology that exceeds expectations, and unlock a world of possibilities with the MC14070BFELG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good protection for the internal components of the logic gates, making them durable and reliable.

Propagation Delay At Nominal Supply: 350 ns

Low propagation delay ensures fast signal processing, making the logic gates suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation on printed circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes these logic gates compatible with a wide range of systems and components.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in various environmental conditions, making these logic gates suitable for industrial applications.

Technical Specifications

Logic Gates MC14070BFELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC14070BFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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