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MC14049BFELG

Onsemi

MC14049BFELG by Onsemi

MC14049BFELG by Onsemi is a CMOS Logic Gates IC with 6 functions. It operates at 5V, has a propagation delay of 140ns, and can withstand temperatures from -55 to 125 °C. Ideal for military-grade applications requiring fast signal processing in compact designs.

Median Price

$0.220

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,780 parts In-Stock

1+ parts

$0.220

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$0.220

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$0.210

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24,780

$0.220

$0.220

$0.210

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Distributors (In-Stock)

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Digiode

USA . 69 parts In-Stock

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$0.209

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69

$0.209

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Chip Stock

USA . 2,669 parts In-Stock

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2,669

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Vyrian

USA . 2,440 parts In-Stock

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Goldney Electronics S.L.

Spain . 1,700 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,371 parts In-Stock

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$0.198

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Corohmni

South Africa . 87 parts In-Stock

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$0.220

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87

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AZTECH Wire

Italy . 593 parts In-Stock

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$16.490

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593

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TANS Electronics

Latvia . 6,234 parts In-Stock

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Andel Nordic

Denmark . 4,456 parts In-Stock

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Kulean Microsystems

USA . 4,335 parts In-Stock

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Microchip USA

USA . 3,925 parts In-Stock

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Problanco Electronics

Mexico . 3,243 parts In-Stock

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SupplyDigital Components

Austria . 2,653 parts In-Stock

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Perfect Parts

USA . 1,928 parts In-Stock

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UHIMA Technologies

Türkiye . 223 parts In-Stock

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Overview

Elevate your logic gate solutions with the MC14049BFELG by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge technology that exceeds industry standards. Designed for a wide range of applications, this logic gate offers unmatched performance and efficiency. Unlock the full potential of your projects with the MC14049BFELG's superior value, benefits, and advantages. Discover the difference with Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package, ensuring longevity and ease of handling.

Propagation Delay At Nominal Supply: 140 ns

Fast propagation delay helps in efficient and quick signal processing.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Suitable voltage for operation in various electronic systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance for efficient performance.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for diverse operating environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Logic Gates MC14049BFELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

140 ns

Propagation Delay (tpd):

140 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Trade Compliance

MC14049BFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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