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MC14011BCPG

Onsemi

MC14011BCPG by Onsemi

MC14011BCPG by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 250 ns at 5V supply, suitable for military-grade applications requiring fast signal processing in a compact IN-LINE package.

Median Price

$0.303

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$0.303

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Vyrian

USA . 9,014 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4,500 parts In-Stock

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Euro-Tech

UK . 969 parts In-Stock

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Digiode

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Chip Stock

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Bristol Electronics

USA . 69 parts In-Stock

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J2 Sourcing AB

Sweden . 35 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 11 parts In-Stock

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Holdelec - ElecDif-Pro

France . 11 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,012 parts In-Stock

1+ parts

$0.303

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$0.297

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$0.303

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$0.297

Argo Parts USA

USA . 2,185 parts In-Stock

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$0.303

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$0.294

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AZTECH Wire

Italy . 746 parts In-Stock

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$14.254

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$17.643

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$16.055

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$14.467

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$16.055

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Ampacity Inc.

Singapore . 130 parts In-Stock

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$42.000

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Kepictronics

USA . 7,485 parts In-Stock

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Kulean Microsystems

USA . 5,380 parts In-Stock

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Microchip USA

USA . 4,626 parts In-Stock

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TANS Electronics

Latvia . 4,615 parts In-Stock

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Problanco Electronics

Mexico . 4,540 parts In-Stock

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Lixinc

USA . 2,610 parts In-Stock

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SupplyDigital Components

Austria . 2,399 parts In-Stock

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Corphita

USA . 1,794 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.297

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$0.288

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$0.282

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$0.297

$0.288

$0.282

UHIMA Technologies

Türkiye . 294 parts In-Stock

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Corohmni

South Africa . 146 parts In-Stock

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Overview

Discover the power of the MC14011BCPG logic gates from Onsemi, designed to deliver unparalleled performance and reliability. With a focus on quality and innovation, Onsemi is a trusted manufacturer in the industry, ensuring that each product meets the highest standards. Ideal for a variety of applications, these logic gates offer customers unmatched value and benefits, providing fast propagation delay and multiple functions in a compact package. Elevate your projects with the MC14011BCPG and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 250 ns

This fast propagation delay allows for quick response times in processing inputs, making the logic gates suitable for time-sensitive applications.

No. of Functions: 4

Having multiple functions in one component reduces the need for additional logic gates, saving space and simplifying circuit design.

Nominal Supply Voltage / Vsup (V): 5

This voltage level is commonly used in many electronic systems, making it compatible with a wide range of applications.

Temperature Grade: MILITARY

This grade indicates that the logic gates are rugged and reliable, suitable for use in harsh environmental conditions.

Technical Specifications

Logic Gates MC14011BCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14011BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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