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MC10H176M

Onsemi

MC10H176M by Onsemi

MC10H176M by Onsemi is a 6-bit ECL latch with 2.2 ns propagation delay and max freq of 250 MHz. It operates b/w 0-75 °C, ideal for high-speed applications like data communication systems. The small outline package with gull wing terminals makes it suitable for surface mount PCB designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,752 parts In-Stock

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Digiode

USA . 1,013 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 388 parts In-Stock

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$21.030

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388

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TANS Electronics

Latvia . 7,127 parts In-Stock

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Kulean Microsystems

USA . 3,962 parts In-Stock

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Problanco Electronics

Mexico . 3,641 parts In-Stock

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SupplyDigital Components

Austria . 1,504 parts In-Stock

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Corphita

USA . 1,297 parts In-Stock

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Corohmni

South Africa . 426 parts In-Stock

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UHIMA Technologies

Türkiye . 412 parts In-Stock

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Microchip USA

USA . 382 parts In-Stock

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Overview

Unleash the power of seamless data storage and retrieval with the MC10H176M by Onsemi. Crafted with precision and quality in mind, this latches & flip-flops device offers unrivaled performance in various applications. Seamlessly integrating cutting-edge technology with user-friendly design, this product ensures maximum efficiency and reliability. Experience the convenience and innovation that Onsemi brings to the table, setting a new standard in the industry. Elevate your projects with the MC10H176M and witness unparalleled value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the circuit board.

No. of Bits: 6

Having 6 bits allows for more complex operations and data storage capabilities.

Propagation Delay (tpd): 2.2 ns

With a low propagation delay, the product provides fast response times for efficient operation.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing and reliable operation.

Maximum Frequency At Nominal Supply: 250000000 Hz

The high maximum frequency allows for high-speed data processing and performance.

Technology: ECL

The ECL technology ensures high-speed and low-power consumption, making the product energy efficient.

Technical Specifications

Latches & Flip-Flops MC10H176M attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

123 mA

Propagation Delay (tpd):

2.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

250 MHz

Trade Compliance

MC10H176M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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