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MC10H175PG

Onsemi

MC10H175PG by Onsemi

MC10H175PG by Onsemi is a 5-bit latches & flip-flops IC with 2.4ns propagation delay at 2V, suitable for ECL technology applications. It features low-level trigger type, operates b/w 0-75 °C, and has a max power supply current of 107mA.

Median Price

$5.242

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,195 parts In-Stock

1+ parts

-

100+ parts

$4.660

1k+ parts

$4.170

10k+ parts

$3.920

5,195

-

$4.660

$4.170

$3.920

Verical

USA . 5,195 parts In-Stock

1+ parts

-

100+ parts

$5.825

1k+ parts

$5.213

10k+ parts

-

5,195

-

$5.825

$5.213

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,072 parts In-Stock

1+ parts

$4.921

100+ parts

-

1k+ parts

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1,072

$4.921

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Vyrian

USA . 7,187 parts In-Stock

1+ parts

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7,187

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 276 parts In-Stock

1+ parts

$4.662

100+ parts

-

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276

$4.662

-

-

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Corohmni

South Africa . 137 parts In-Stock

1+ parts

$5.020

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-

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137

$5.020

-

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AZTECH Wire

Italy . 109 parts In-Stock

1+ parts

$8.050

100+ parts

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109

$8.050

-

-

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Kulean Microsystems

USA . 7,654 parts In-Stock

1+ parts

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7,654

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Continental Prestige Electronics

USA . 5,195 parts In-Stock

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5,195

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SupplyDigital Components

Austria . 3,445 parts In-Stock

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3,445

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Problanco Electronics

Mexico . 3,193 parts In-Stock

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3,193

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UHIMA Technologies

Türkiye . 808 parts In-Stock

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808

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TANS Electronics

Latvia . 357 parts In-Stock

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357

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Microchip USA

USA . 213 parts In-Stock

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213

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Overview

Elevate your designs with the MC10H175PG by Onsemi, a high-quality latch and flip-flop that offers unmatched reliability and performance. Manufactured by Onsemi, a leader in semiconductor solutions, this product is perfect for a wide range of applications. With fast propagation delay, low trigger type, and true output polarity, this versatile component ensures seamless operation. Experience the value and benefits of choosing Onsemi's MC10H175PG for your next project and unlock new possibilities in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 2.4 ns

Low propagation delay ensures fast response time, making this latch efficient for high-speed applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and space-saving design in electronic circuits.

No. of Bits: 5

5 bits provide sufficient data storage capacity for many digital applications.

No. of Terminals: 16

Ample terminals allow for versatile connectivity options in circuits, enhancing the product's compatibility.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics provide flexibility in circuit design and compatibility with different types of devices.

Trigger Type: LOW LEVEL

Low-level trigger type ensures reliable operation and compatibility with various input signals.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade indicates the product's suitability for a wide range of operating temperatures, making it versatile.

Technical Specifications

Latches & Flip-Flops MC10H175PG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

No. of Bits:

5

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

107 mA

Propagation Delay At Nominal Supply:

2.4 ns

Propagation Delay (tpd):

2 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

FF/Latches

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

LOW LEVEL

Width:

7.62 mm

Trade Compliance

MC10H175PG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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