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MC10H131PG

Onsemi

MC10H131PG by Onsemi

MC10H131PG by Onsemi is a 2-bit latch with 16 terminals and 1.7 ns propagation delay. It operates b/w 0-75°C, has a max frequency of 250 MHz, and uses ECL technology. Ideal for applications requiring positive edge trigger and complementary output polarity in commercial extended temperature environments.

Median Price

$3.480

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,196 parts In-Stock

1+ parts

-

100+ parts

$3.250

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1,196

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$3.250

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Rochester

USA . 1,121 parts In-Stock

1+ parts

-

100+ parts

$3.480

1k+ parts

$3.110

10k+ parts

$2.930

1,121

-

$3.480

$3.110

$2.930

Verical

USA . 1,121 parts In-Stock

1+ parts

-

100+ parts

$4.350

1k+ parts

$3.888

10k+ parts

$3.663

1,121

-

$4.350

$3.888

$3.663

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 961 parts In-Stock

1+ parts

$3.686

100+ parts

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961

$3.686

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Vyrian

USA . 2,507 parts In-Stock

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2,507

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GSS - Global Semi Support

USA . 132 parts In-Stock

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132

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 30 parts In-Stock

1+ parts

$0.450

100+ parts

-

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30

$0.450

-

-

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Corphita

USA . 413 parts In-Stock

1+ parts

$3.492

100+ parts

-

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413

$3.492

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Corohmni

South Africa . 105 parts In-Stock

1+ parts

$3.880

100+ parts

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105

$3.880

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Component Stockers USA

USA . 948 parts In-Stock

1+ parts

$4.000

100+ parts

$3.770

1k+ parts

$3.400

10k+ parts

-

948

$4.000

$3.770

$3.400

-

AZTECH Wire

Italy . 888 parts In-Stock

1+ parts

$16.990

100+ parts

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888

$16.990

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SupplyDigital Components

Austria . 6,093 parts In-Stock

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Kulean Microsystems

USA . 2,778 parts In-Stock

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Problanco Electronics

Mexico . 2,420 parts In-Stock

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Continental Prestige Electronics

USA . 1,527 parts In-Stock

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100+ parts

$3.290

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1,527

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$3.290

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Perfect Parts

USA . 600 parts In-Stock

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600

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TANS Electronics

Latvia . 499 parts In-Stock

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499

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UHIMA Technologies

Türkiye . 464 parts In-Stock

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464

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Microchip USA

USA . 156 parts In-Stock

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156

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Overview

Unlock limitless possibilities with the MC10H131PG by Onsemi. Crafted with precision and quality, this latches & flip-flops device offers unparalleled performance in a compact package. Whether you're in need of fast triggering or efficient output characteristics, this product delivers it all. Perfect for a wide range of applications, from telecommunications to industrial controls, this Onsemi creation is designed to exceed expectations. Elevate your projects with the MC10H131PG and experience the difference in quality and reliability that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to impact, making it a reliable choice for various applications.

No. of Bits: 2

Having 2 bits allows for a simple and efficient binary storage and processing capability, suitable for basic digital logic operations.

Propagation Delay (tpd): 1.7 ns

With a low propagation delay of 1.7 ns, this latch or flip-flop provides high-speed operation and responsiveness in digital circuits.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature of 75 °C ensures reliable performance even in demanding thermal conditions.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics offer flexibility in circuit design and compatibility with various transistor configurations.

Trigger Type: POSITIVE EDGE

The positive edge trigger type enables precise timing control and synchronization in sequential logic circuits.

Technology: ECL

The ECL (Emitter-Coupled Logic) technology provides high-speed operation and low power consumption, ideal for high-performance applications.

Technical Specifications

Latches & Flip-Flops MC10H131PG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Maximum Power Supply Current (ICC):

62 mA

Propagation Delay (tpd):

1.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

FF/Latches

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

250 MHz

Trade Compliance

MC10H131PG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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