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MC10EP52D

Onsemi

MC10EP52D by Onsemi

MC10EP52D by Onsemi is a ECL technology latch with 0.38 ns propagation delay, 3.3V nominal voltage, and 4000000000 Hz max frequency. Ideal for industrial applications requiring fast positive edge triggering in a compact small outline package.

Median Price

$2.775

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,073 parts In-Stock

1+ parts

-

100+ parts

$2.480

1k+ parts

$2.220

10k+ parts

$2.090

3,073

-

$2.480

$2.220

$2.090

Avnet

USA . 3,073 parts In-Stock

1+ parts

-

100+ parts

$2.960

1k+ parts

$2.640

10k+ parts

$2.480

3,073

-

$2.960

$2.640

$2.480

Verical

USA . 1,917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.775

10k+ parts

$2.612

1,917

-

-

$2.775

$2.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 798 parts In-Stock

1+ parts

$2.632

100+ parts

-

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798

$2.632

-

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Vyrian

USA . 8,053 parts In-Stock

1+ parts

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8,053

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Electronic Expediters

USA . 1,721 parts In-Stock

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1,721

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Prism Electronics

USA . 56 parts In-Stock

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Electronics Depot

USA . 20 parts In-Stock

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20

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Bristol Electronics

USA . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 698 parts In-Stock

1+ parts

$2.493

100+ parts

-

1k+ parts

-

10k+ parts

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698

$2.493

-

-

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Andel Nordic

Denmark . 2,710 parts In-Stock

1+ parts

$2.569

100+ parts

-

1k+ parts

$2.467

10k+ parts

$2.467

2,710

$2.569

-

$2.467

$2.467

Corohmni

South Africa . 446 parts In-Stock

1+ parts

$2.650

100+ parts

-

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446

$2.650

-

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AZTECH Wire

Italy . 50 parts In-Stock

1+ parts

$17.060

100+ parts

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50

$17.060

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Kulean Microsystems

USA . 5,027 parts In-Stock

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5,027

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SupplyDigital Components

Austria . 4,542 parts In-Stock

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TANS Electronics

Latvia . 3,970 parts In-Stock

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Continental Prestige Electronics

USA . 3,073 parts In-Stock

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$2.360

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$2.360

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Problanco Electronics

Mexico . 1,295 parts In-Stock

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UHIMA Technologies

Türkiye . 606 parts In-Stock

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606

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Kepictronics

USA . 296 parts In-Stock

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296

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Microchip USA

USA . 147 parts In-Stock

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Perfect Parts

USA . 63 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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25

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Overview

Experience the unparalleled performance of the MC10EP52D by Onsemi, a top-of-the-line latches & flip-flops component that boasts exceptional quality and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product offers fast propagation delay, high-frequency operation, and a wide operating temperature range, making it ideal for a variety of industrial applications. With its small outline package and complementary output polarity, the MC10EP52D provides customers with a valuable solution that delivers superior functionality and efficiency. Choose Onsemi for cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the latch or flip-flop, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.41 ns

The low propagation delay at nominal supply ensures fast and efficient operation of the latch or flip-flop, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mount compatible allows for easy and convenient installation on printed circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is commonly used in many electronic systems, making this latch or flip-flop compatible with a wide range of applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 °C to 85°C makes this latch or flip-flop suitable for use in harsh environmental conditions.

Maximum Frequency At Nominal Supply: 4000000000 Hz

The high maximum frequency at nominal supply of 4GHz indicates that this latch or flip-flop can handle high-speed data processing and communication.

Technology: ECL

The ECL technology used in this latch or flip-flop offers high-speed operation and low power consumption, making it ideal for performance-critical applications.

Technical Specifications

Latches & Flip-Flops MC10EP52D attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000000 Hz

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay At Nominal Supply:

.41 ns

Propagation Delay (tpd):

.38 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

MC10EP52D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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