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MC10EP51DTR2G

Onsemi

MC10EP51DTR2G by Onsemi

MC10EP51DTR2G by Onsemi is a ECL technology latch with 0.37 ns propagation delay, 3.3V nominal voltage, and 3000000000 Hz max frequency. It is used in industrial applications requiring positive edge trigger and complementary output polarity.

Median Price

$4.208

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,100 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

2,100

-

$3.740

$3.350

$3.150

Verical

USA . 2,100 parts In-Stock

1+ parts

-

100+ parts

$4.675

1k+ parts

$4.188

10k+ parts

$3.938

2,100

-

$4.675

$4.188

$3.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,572 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

1,572

$3.962

-

-

-

Vyrian

USA . 8,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,663

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 2,308 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,308

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,382 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

2,382

$3.753

-

-

-

Corohmni

South Africa . 168 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

168

$4.170

-

-

-

Component Stockers USA

USA . 2,229 parts In-Stock

1+ parts

$4.270

100+ parts

$4.020

1k+ parts

$3.630

10k+ parts

-

2,229

$4.270

$4.020

$3.630

-

AZTECH Wire

Italy . 701 parts In-Stock

1+ parts

$20.140

100+ parts

-

1k+ parts

-

10k+ parts

-

701

$20.140

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$24.679

100+ parts

$22.458

1k+ parts

$20.237

10k+ parts

-

2,500

$24.679

$22.458

$20.237

-

Problanco Electronics

Mexico . 8,336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,336

-

-

-

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TANS Electronics

Latvia . 5,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,870

-

-

-

-

RC Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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5,000

-

-

-

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SupplyDigital Components

Austria . 2,304 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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2,304

-

-

-

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Kulean Microsystems

USA . 1,647 parts In-Stock

1+ parts

-

100+ parts

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1,647

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Microchip USA

USA . 251 parts In-Stock

1+ parts

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100+ parts

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251

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UHIMA Technologies

Türkiye . 103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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103

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-

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Overview

Discover the cutting-edge MC10EP51DTR2G by Onsemi, a top-of-the-line Latches & Flip-Flops component that promises unparalleled quality and reliability. Designed with precision and expertise, this product is perfect for a wide range of applications. From industrial to consumer electronics, this innovative piece of technology offers fast propagation delay and optimal performance at both high and low temperatures. Unlock the potential of your projects with the MC10EP51DTR2G, where value meets efficiency in every aspect. Trust in Onsemi for superior products that deliver beyond expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch or flip-flop, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 0.42 ns

The low propagation delay ensures fast and efficient operation of the latch or flip-flop, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation and integration of this latch or flip-flop easier and more convenient.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many electronics, making this latch or flip-flop compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this latch or flip-flop can perform reliably in various environments with potentially elevated temperatures.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise and accurate signal processing, making this latch or flip-flop suitable for critical timing applications.

Technology: ECL

The ECL technology offers high-speed performance and low power consumption, making this latch or flip-flop ideal for demanding applications.

Technical Specifications

Latches & Flip-Flops MC10EP51DTR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay At Nominal Supply:

.42 ns

Propagation Delay (tpd):

.37 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Trade Compliance

MC10EP51DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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