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MC10EL52DG

Onsemi

MC10EL52DG by Onsemi

MC10EL52DG by Onsemi is a latches & flip-flops IC with 0.465 ns propagation delay, 5V nominal voltage, and 2200 MHz min fmax. It is used in industrial applications requiring positive edge trigger type and complementary output polarity.

Median Price

$4.568

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 116 parts In-Stock

1+ parts

$5.990

100+ parts

$3.940

1k+ parts

$3.410

10k+ parts

$3.330

116

$5.990

$3.940

$3.410

$3.330

DigiKey

USA . 80 parts In-Stock

1+ parts

$5.990

100+ parts

$3.860

1k+ parts

$3.540

10k+ parts

$3.374

80

$5.990

$3.860

$3.540

$3.374

Rochester

USA . 9,614 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

9,614

-

$3.130

$2.800

$2.630

Verical

USA . 8,918 parts In-Stock

1+ parts

-

100+ parts

$3.145

1k+ parts

-

10k+ parts

-

8,918

-

$3.145

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,028 parts In-Stock

1+ parts

$3.296

100+ parts

-

1k+ parts

-

10k+ parts

-

2,028

$3.296

-

-

-

Bristol Electronics

USA . 5 parts In-Stock

1+ parts

$5.152

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$5.152

-

-

-

Flip Electronics

USA . 9,114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,114

-

-

-

-

Vyrian

USA . 2,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,985

-

-

-

-

Elcom Components

USA . 415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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415

-

-

-

-

Sea View Technologies

USA . 164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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164

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,490 parts In-Stock

1+ parts

$2.950

100+ parts

-

1k+ parts

-

10k+ parts

-

2,490

$2.950

-

-

-

Corphita

USA . 1,864 parts In-Stock

1+ parts

$3.123

100+ parts

-

1k+ parts

-

10k+ parts

-

1,864

$3.123

-

-

-

Corohmni

South Africa . 50 parts In-Stock

1+ parts

$3.470

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$3.470

-

-

-

Component Stockers USA

USA . 6,021 parts In-Stock

1+ parts

$3.600

100+ parts

$3.380

1k+ parts

$3.060

10k+ parts

-

6,021

$3.600

$3.380

$3.060

-

Problanco Electronics

Mexico . 5,165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,165

-

-

-

-

Lixinc

USA . 4,967 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,967

-

-

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TANS Electronics

Latvia . 3,679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,679

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

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Kulean Microsystems

USA . 781 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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781

-

-

-

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SupplyDigital Components

Austria . 753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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753

-

-

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UHIMA Technologies

Türkiye . 370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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370

-

-

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Perfect Parts

USA . 34 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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34

-

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-

-

Overview

Upgrade your electronics with the MC10EL52DG by Onsemi, a top-quality latches & flip-flops component designed for high-performance applications. With a fast propagation delay of only 0.515 ns and a wide temperature range, this product delivers reliable results in industrial settings. Onsemi's commitment to innovation and precision engineering ensures that every MC10EL52DG meets the highest standards of quality and durability. Trust Onsemi to provide you with cutting-edge technology that enhances the efficiency and effectiveness of your electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for long-term use.

Propagation Delay At Nominal Supply: 0.515 ns

Low propagation delay ensures fast operation and efficient performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

Nominal Supply Voltage / Vsup (V): 5

Suitable operating voltage for standard electronic circuits, ensuring compatibility with most systems.

Power Supplies (V): -5.2

Provides a negative power supply option, expanding the product's compatibility with various circuit designs.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components in a circuit, enabling versatile usage.

Package Style (Meter): SMALL OUTLINE

Compact small outline package design saves space on the PCB and allows for high-density mounting.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Output Characteristics: OPEN-EMITTER

Open-emitter configuration provides flexibility for different output connections and circuit designs.

Trigger Type: POSITIVE EDGE

Positive edge trigger type allows for precise control and synchronization in digital systems.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable operation in cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides a protective coating and enhances solderability for easy assembly.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and component placement.

Width: 3.9 mm

Narrow width design saves space on the PCB and allows for high-density mounting.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies logic design and improves signal integrity.

Minimum Supply Voltage (Vsup): 4.2 V

Low minimum supply voltage allows for operation in low-power applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures reliable soldering during assembly.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range makes the product suitable for harsh operating environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and facilitates automated assembly processes.

Packing Method: TUBE

Tube packing method ensures safe transportation and storage of the product.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy connection and compatibility with common PCB layouts.

Minimum fmax: 2200 MHz

High minimum fmax value indicates fast switching speed and high-frequency performance.

Maximum Supply Voltage (Vsup): 5.7 V

Sufficient maximum supply voltage rating for reliable operation and protection against voltage spikes.

Maximum Power Supply Current (ICC): 25 mA

Low power supply current consumption ensures energy efficiency and prevents overheating.

Technical Specifications

Latches & Flip-Flops MC10EL52DG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

.515 ns

Propagation Delay (tpd):

.465 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

2200 MHz

Trade Compliance

MC10EL52DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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