Loading...

MC10EL35DT

Onsemi

MC10EL35DT by Onsemi

MC10EL35DT by Onsemi is a dual-bit ECL flip-flop with 0.7 ns propagation delay, operating at 1.4 GHz max frequency. It has a supply voltage range of 4.2V to 5.7V and operates in industrial temperatures (-40 °C to 85°C). Ideal for high-speed applications requiring positive edge triggering in a compact thin profile package.

Median Price

$1.649

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,265 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.390

10k+ parts

$1.310

1,265

-

$1.560

$1.390

$1.310

Verical

USA . 1,265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.738

10k+ parts

$1.637

1,265

-

-

$1.738

$1.637

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 61 parts In-Stock

1+ parts

$1.644

100+ parts

-

1k+ parts

-

10k+ parts

-

61

$1.644

-

-

-

Vyrian

USA . 4,537 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,537

-

-

-

-

Connector Distribution Corp

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Right Parts Inc.

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,361 parts In-Stock

1+ parts

$1.557

100+ parts

-

1k+ parts

-

10k+ parts

-

1,361

$1.557

-

-

-

Corohmni

South Africa . 213 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$1.660

-

-

-

Component Stockers USA

USA . 1,656 parts In-Stock

1+ parts

$1.790

100+ parts

$1.680

1k+ parts

$1.520

10k+ parts

-

1,656

$1.790

$1.680

$1.520

-

AZTECH Wire

Italy . 85 parts In-Stock

1+ parts

$17.810

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$17.810

-

-

-

SupplyDigital Components

Austria . 7,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,503

-

-

-

-

TANS Electronics

Latvia . 5,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,661

-

-

-

-

Kulean Microsystems

USA . 2,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,855

-

-

-

-

Continental Prestige Electronics

USA . 1,265 parts In-Stock

1+ parts

-

100+ parts

$1.470

1k+ parts

-

10k+ parts

-

1,265

-

$1.470

-

-

Problanco Electronics

Mexico . 1,210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,210

-

-

-

-

UHIMA Technologies

Türkiye . 601 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

601

-

-

-

-

Microchip USA

USA . 219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

219

-

-

-

-

Overview

Unlock endless possibilities with the MC10EL35DT by Onsemi! This cutting-edge latch & flip-flop device offers unparalleled quality and reliability, manufactured by the industry leader in electronic components. Ideal for a wide range of applications, this product provides lightning-fast performance with a propagation delay of just 0.7 ns. With a compact design and high-frequency capabilities, the MC10EL35DT is the perfect solution for your electronic needs, delivering exceptional value and efficiency to customers looking to stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures long-lasting performance and ease of handling.

Propagation Delay At Nominal Supply: 0.745 ns

Fast propagation delay ensures quick response times, making it suitable for high-speed applications.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs.

Package Shape: SQUARE

Compact square shape fits well in tight spaces and helps optimize PCB layout.

Nominal Supply Voltage / Vsup (V): 5

Operates at standard voltage levels, ensuring compatibility with a wide range of applications.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making it ideal for high-frequency applications.

Maximum Frequency At Nominal Supply: 1400000000 Hz

Capable of handling high-frequency operations, making it suitable for fast data processing.

Technical Specifications

Latches & Flip-Flops MC10EL35DT attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1400000000 Hz

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

32 mA

Propagation Delay At Nominal Supply:

.745 ns

Propagation Delay (tpd):

.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Minimum fmax:

1800 MHz

Trade Compliance

MC10EL35DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20