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MC10EL35DR2G

Onsemi

MC10EL35DR2G by Onsemi

MC10EL35DR2G by Onsemi is a 2-bit latch with 0.7 ns propagation delay, suitable for industrial applications. It operates at -40 to 85 °C, with a max frequency of 1.4 GHz and power supply current of 32 mA. This ECL technology flip-flop has a small outline package style and Gull Wing terminal form for surface mount assembly.

Median Price

$2.969

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,482 parts In-Stock

1+ parts

-

100+ parts

$2.800

1k+ parts

$2.510

10k+ parts

$2.360

8,482

-

$2.800

$2.510

$2.360

Verical

USA . 8,482 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.138

10k+ parts

$2.950

8,482

-

-

$3.138

$2.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,813 parts In-Stock

1+ parts

$2.964

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-

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1,813

$2.964

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DigiKey Marketplace

USA . 8,482 parts In-Stock

1+ parts

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8,482

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Vyrian

USA . 4,886 parts In-Stock

1+ parts

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4,886

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LIBRA Elektronik GmbH

Germany . 196 parts In-Stock

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196

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 740 parts In-Stock

1+ parts

$2.808

100+ parts

-

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740

$2.808

-

-

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Corohmni

South Africa . 363 parts In-Stock

1+ parts

$3.120

100+ parts

-

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363

$3.120

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AZTECH Wire

Italy . 243 parts In-Stock

1+ parts

$16.150

100+ parts

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243

$16.150

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Continental Prestige Electronics

USA . 8,482 parts In-Stock

1+ parts

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100+ parts

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$2.650

10k+ parts

-

8,482

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$2.650

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QUARKTWIN TECHNOLOGY LTD

USA . 7,793 parts In-Stock

1+ parts

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7,793

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Problanco Electronics

Mexico . 4,129 parts In-Stock

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4,129

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TANS Electronics

Latvia . 4,070 parts In-Stock

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4,070

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Kulean Microsystems

USA . 3,630 parts In-Stock

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3,630

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SupplyDigital Components

Austria . 3,487 parts In-Stock

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3,487

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Microchip USA

USA . 230 parts In-Stock

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230

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UHIMA Technologies

Türkiye . 190 parts In-Stock

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190

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Overview

Experience the power of cutting-edge technology with the MC10EL35DR2G by Onsemi. As a leading manufacturer in the industry, Onsemi's latches & flip-flops offer unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with fast and efficient operation, ensuring seamless performance. Trust Onsemi to deliver value, benefits, and advantages that exceed expectations. Choose the MC10EL35DR2G for unmatched quality and innovation in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the latch, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 0.745 ns

Fast propagation delay allows for quick response times, making this latch suitable for high-speed applications.

Surface Mount: YES

Ease of installation and space-saving design for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 5

Common supply voltage that is compatible with many electronic systems.

Trigger Type: POSITIVE EDGE

Provides precise control over when the latch switches states, improving overall system performance.

Maximum Frequency At Nominal Supply: 1400000000 Hz

High-frequency capability makes this latch suitable for demanding applications that require fast operation.

Technical Specifications

Latches & Flip-Flops MC10EL35DR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1400000000 Hz

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

32 mA

Propagation Delay At Nominal Supply:

.745 ns

Propagation Delay (tpd):

.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

1800 MHz

Trade Compliance

MC10EL35DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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