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MC10EL31DT

Onsemi

MC10EL31DT by Onsemi

MC10EL31DT by Onsemi is a ECL technology latch with 8 terminals, operating at -40 to 85 °C. It has a propagation delay of 0.59 ns and can handle up to 2.2 GHz frequency. Ideal for industrial applications requiring positive edge triggering in a compact square package.

Median Price

$1.822

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$1.720

1k+ parts

$1.540

10k+ parts

$1.450

360

-

$1.720

$1.540

$1.450

Verical

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.925

10k+ parts

$1.813

360

-

-

$1.925

$1.813

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,402 parts In-Stock

1+ parts

$1.824

100+ parts

-

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-

10k+ parts

-

2,402

$1.824

-

-

-

Vyrian

USA . 3,427 parts In-Stock

1+ parts

-

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-

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3,427

-

-

-

-

DigiKey Marketplace

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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360

-

-

-

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Prism Electronics

USA . 25 parts In-Stock

1+ parts

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-

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25

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,767 parts In-Stock

1+ parts

$1.728

100+ parts

-

1k+ parts

-

10k+ parts

-

1,767

$1.728

-

-

-

Corohmni

South Africa . 241 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

-

10k+ parts

-

241

$1.830

-

-

-

Component Stockers USA

USA . 304 parts In-Stock

1+ parts

$1.970

100+ parts

$1.850

1k+ parts

-

10k+ parts

-

304

$1.970

$1.850

-

-

AZTECH Wire

Italy . 334 parts In-Stock

1+ parts

$8.770

100+ parts

-

1k+ parts

-

10k+ parts

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334

$8.770

-

-

-

TANS Electronics

Latvia . 6,786 parts In-Stock

1+ parts

-

100+ parts

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6,786

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-

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SupplyDigital Components

Austria . 4,438 parts In-Stock

1+ parts

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4,438

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Problanco Electronics

Mexico . 823 parts In-Stock

1+ parts

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823

-

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Kulean Microsystems

USA . 493 parts In-Stock

1+ parts

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493

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Continental Prestige Electronics

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$1.630

1k+ parts

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10k+ parts

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360

-

$1.630

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Microchip USA

USA . 306 parts In-Stock

1+ parts

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100+ parts

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306

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UHIMA Technologies

Türkiye . 75 parts In-Stock

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75

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Perfect Parts

USA . 28 parts In-Stock

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28

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Overview

Unleash the power of seamless data processing with the MC10EL31DT by Onsemi. Crafted with precision and expertise, this flip-flop offers unparalleled reliability and performance in a variety of applications. From industrial automation to telecommunications, this product delivers value by ensuring fast and accurate data transmission. Experience the benefits of high-speed operation and efficient signal processing with the MC10EL31DT, setting new standards for quality and innovation in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components of the latch/flip-flop.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with a wide range of electronic systems.

Propagation Delay (tpd): 0.59 ns

Fast propagation delay of 0.59 ns ensures quick response and operation of the latch/flip-flop.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range of -40 to 85 °C ensures reliable operation in various environmental conditions.

Maximum Frequency At Nominal Supply: 2000000000 Hz

High maximum frequency of 2GHz allows for high-speed data processing and operations.

Technology: ECL

ECL technology provides high-speed performance and low power consumption for efficient operation.

Maximum Power Supply Current (ICC): 32 mA

Low power supply current of 32mA helps in reducing energy consumption and heat generation.

Technical Specifications

Latches & Flip-Flops MC10EL31DT attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000000 Hz

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

32 mA

Propagation Delay (tpd):

.59 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Minimum fmax:

2200 MHz

Trade Compliance

MC10EL31DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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