Loading...

MC100EP196BMNR4G

Onsemi

MC100EP196BMNR4G by Onsemi

MC100EP196BMNR4G by Onsemi is a delay line with 15.25ns propagation delay, 32 terminals, and ECL technology. It has a programmable total delay of 12.4ns and operates in industrial temperature range. Ideal for applications requiring precise signal synchronization in high-speed communication systems.

Median Price

$12.018

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 9 parts In-Stock

1+ parts

$284.760

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$284.760

-

-

-

DigiKey

USA . 7,815 parts In-Stock

1+ parts

-

100+ parts

$11.560

1k+ parts

$11.560

10k+ parts

$11.560

7,815

-

$11.560

$11.560

$11.560

Rochester

USA . 7,345 parts In-Stock

1+ parts

-

100+ parts

$9.980

1k+ parts

$8.930

10k+ parts

$8.400

7,345

-

$9.980

$8.930

$8.400

Verical

USA . 4,485 parts In-Stock

1+ parts

-

100+ parts

$12.475

1k+ parts

$11.162

10k+ parts

-

4,485

-

$12.475

$11.162

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,281 parts In-Stock

1+ parts

$8.470

100+ parts

-

1k+ parts

-

10k+ parts

-

2,281

$8.470

-

-

-

Digiode

USA . 985 parts In-Stock

1+ parts

$10.564

100+ parts

-

1k+ parts

-

10k+ parts

-

985

$10.564

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 440 parts In-Stock

1+ parts

$8.470

100+ parts

-

1k+ parts

-

10k+ parts

-

440

$8.470

-

-

-

Corphita

USA . 626 parts In-Stock

1+ parts

$10.008

100+ parts

-

1k+ parts

-

10k+ parts

-

626

$10.008

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,123

-

-

-

-

Continental Prestige Electronics

USA . 7,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$13.340

10k+ parts

-

7,830

-

-

$13.340

-

Problanco Electronics

Mexico . 6,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,361

-

-

-

-

SupplyDigital Components

Austria . 5,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,223

-

-

-

-

Kulean Microsystems

USA . 2,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,048

-

-

-

-

TANS Electronics

Latvia . 623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

623

-

-

-

-

Perfect Parts

USA . 384 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

384

-

-

-

-

Microchip USA

USA . 198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

198

-

-

-

-

UHIMA Technologies

Türkiye . 91 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91

-

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Experience precision and reliability with the MC100EP196BMNR4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers quality delay lines that are essential in various applications such as telecommunications, networking, and data communications. With a propagation delay of 15.25 ns and 1023 taps/steps, this programmable delay line offers unmatched value and performance. Trust Onsemi to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the MC100EP196BMNR4G today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 15.25 ns

Low propagation delay ensures fast signal processing.

Surface Mount: YES

Ease of installation and space-saving design.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard power supply voltages.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high temperature requirements.

Terminal Finish: TIN

Tin terminals provide good electrical conductivity and corrosion resistance.

Technology: ECL

ECL technology offers high-speed performance and low power consumption.

Programmable Delay Line: YES

Allows for customization and fine-tuning of delay settings.

Technical Specifications

Delay Lines MC100EP196BMNR4G attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V

Family:

100E

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Taps/Steps:

1023

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-3.3

Maximum Power Supply Current (ICC):

175 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

15.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Nominal Total Delay (td):

12.4 ns

Width:

5 mm

Trade Compliance

MC100EP196BMNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20