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MC100EL52DTG

Onsemi

MC100EL52DTG by Onsemi

MC100EL52DTG by Onsemi is a ECL technology flip-flop with 0.465 ns propagation delay, 2200 MHz max frequency, and 5V nominal supply. Ideal for industrial applications requiring fast trigger response and complementary output polarity in a compact thin profile package.

Median Price

$3.522

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 495 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

495

-

$3.130

$2.800

$2.630

Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$3.913

1k+ parts

$3.500

10k+ parts

$3.288

200

-

$3.913

$3.500

$3.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,831 parts In-Stock

1+ parts

$3.306

100+ parts

-

1k+ parts

-

10k+ parts

-

1,831

$3.306

-

-

-

Vyrian

USA . 8,296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,296

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 359 parts In-Stock

1+ parts

$3.132

100+ parts

-

1k+ parts

-

10k+ parts

-

359

$3.132

-

-

-

Corohmni

South Africa . 150 parts In-Stock

1+ parts

$3.320

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$3.320

-

-

-

Component Stockers USA

USA . 515 parts In-Stock

1+ parts

$3.530

100+ parts

$3.320

1k+ parts

-

10k+ parts

-

515

$3.530

$3.320

-

-

AZTECH Wire

Italy . 1,028 parts In-Stock

1+ parts

$15.150

100+ parts

-

1k+ parts

-

10k+ parts

-

1,028

$15.150

-

-

-

TANS Electronics

Latvia . 7,230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,230

-

-

-

-

Kulean Microsystems

USA . 6,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,795

-

-

-

-

Problanco Electronics

Mexico . 6,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,550

-

-

-

-

Microchip USA

USA . 5,218 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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5,218

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-

-

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SupplyDigital Components

Austria . 3,938 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,938

-

-

-

-

Continental Prestige Electronics

USA . 495 parts In-Stock

1+ parts

-

100+ parts

$2.950

1k+ parts

-

10k+ parts

-

495

-

$2.950

-

-

UHIMA Technologies

Türkiye . 216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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216

-

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-

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Overview

Experience the unparalleled precision and reliability of the MC100EL52DTG by Onsemi, a leading manufacturer in the industry. This latches & flip-flops category gem offers lightning-fast 0.51 ns propagation delay, making it perfect for high-speed applications. Its compact design and industrial-grade temperature range ensure versatility and durability. With a nominal supply voltage of 5V and maximum frequency of 2.2 GHz, this product delivers exceptional performance every time. Elevate your projects with the unmatched quality and value of the MC100EL52DTG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch & flip-flop lightweight and durable, ideal for portable electronic devices.

Propagation Delay At Nominal Supply: 0.51 ns

With a fast propagation delay of 0.51 ns, this product ensures quick response times for efficient data processing.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this latch & flip-flop compatible with standard electronic systems.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can withstand harsh environmental conditions.

Maximum Frequency At Nominal Supply: 2.2 GHz

Capable of operating at a maximum frequency of 2.2 GHz, this latch & flip-flop is suitable for high-speed applications.

Technical Specifications

Latches & Flip-Flops MC100EL52DTG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100EL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

2200000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

29 mA

Propagation Delay At Nominal Supply:

.51 ns

Propagation Delay (tpd):

.465 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Minimum fmax:

2200 MHz

Trade Compliance

MC100EL52DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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