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MC100E452FNG

Onsemi

MC100E452FNG by Onsemi

MC100E452FNG by Onsemi is a 5-bit ECL latch with 0.85 ns propagation delay. Operating at 1100 MHz, it has a supply voltage range of 4.2V to 5.7V and triggers on positive edge for applications requiring high-speed data processing in electronic systems.

Median Price

$6.249

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 7,805 parts In-Stock

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7,805

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Rochester

USA . 2,200 parts In-Stock

1+ parts

-

100+ parts

$5.560

1k+ parts

$4.970

10k+ parts

$4.680

2,200

-

$5.560

$4.970

$4.680

Verical

USA . 1,931 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

$6.200

10k+ parts

$5.838

1,931

-

$6.938

$6.200

$5.838

Distributors (In-Stock)

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Digiode

USA . 196 parts In-Stock

1+ parts

$5.871

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196

$5.871

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Flip Electronics

USA . 7,805 parts In-Stock

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7,805

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Vyrian

USA . 6,399 parts In-Stock

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6,399

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Inventory MP

USA . 18 parts In-Stock

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Bristol Electronics

USA . 18 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 122 parts In-Stock

1+ parts

$5.140

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122

$5.140

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Corphita

USA . 1,251 parts In-Stock

1+ parts

$5.562

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-

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1,251

$5.562

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AZTECH Wire

Italy . 543 parts In-Stock

1+ parts

$16.190

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543

$16.190

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TANS Electronics

Latvia . 5,742 parts In-Stock

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Problanco Electronics

Mexico . 5,297 parts In-Stock

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Kulean Microsystems

USA . 5,101 parts In-Stock

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Continental Prestige Electronics

USA . 2,274 parts In-Stock

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2,274

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SupplyDigital Components

Austria . 2,222 parts In-Stock

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UHIMA Technologies

Türkiye . 605 parts In-Stock

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605

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Microchip USA

USA . 241 parts In-Stock

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Perfect Parts

USA . 31 parts In-Stock

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Overview

Experience top-notch performance and reliability with the MC100E452FNG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality latches & flip-flops that are perfect for a wide range of applications. With a nominal supply voltage of 5V and a maximum frequency of 1.1GHz, this product offers unmatched value and benefits to customers looking for efficient and precise electronic components. Trust Onsemi for all your electronic needs and take your projects to the next level with the MC100E452FNG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronic applications.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on circuit boards, saving time and effort during assembly.

No. of Bits: 5

Having 5 bits allows for more complex operations and logic functions to be performed, increasing the versatility of the product.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources and electronic systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high heat environments without compromising performance.

Output Polarity: COMPLEMENTARY

The complementary output polarity allows for easy integration with other electronic components and systems, enhancing overall functionality.

Technology: ECL

The ECL technology offers high-speed operation and low power consumption, making the product efficient and reliable for various applications.

Technical Specifications

Latches & Flip-Flops MC100E452FNG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Count Direction:

RIGHT

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1100000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

5

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay (tpd):

.85 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

1100 MHz

Trade Compliance

MC100E452FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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