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LV8415XA-MH

Onsemi

LV8415XA-MH by Onsemi

LV8415XA-MH by Onsemi is a Motion Control IC with 32 terminals, operating voltage of 2.7-5.5V, and max output current of 0.6A. Ideal for stepper motor control applications due to its BICMOS technology and compact GRID ARRAY package style. Operating temp range: -20 to 85 °C makes it versatile for various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,965 parts In-Stock

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Digiode

USA . 1,724 parts In-Stock

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AZTECH Wire

Italy . 249 parts In-Stock

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$22.070

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Component Stockers USA

USA . 789 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 4,789 parts In-Stock

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Problanco Electronics

Mexico . 3,523 parts In-Stock

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SupplyDigital Components

Austria . 3,305 parts In-Stock

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TANS Electronics

Latvia . 2,977 parts In-Stock

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Corphita

USA . 1,323 parts In-Stock

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UHIMA Technologies

Türkiye . 858 parts In-Stock

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Corohmni

South Africa . 395 parts In-Stock

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Microchip USA

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Overview

Enhance your motion control systems with the reliable LV8415XA-MH by Onsemi. Known for their top-notch quality and innovation, Onsemi's Motion Control ICs are designed to optimize precision and efficiency in various applications. This product offers unparalleled value with its superior performance and durability, making it an ideal choice for those seeking seamless motion control solutions. Experience the benefits of advanced technology and unmatched reliability with the LV8415XA-MH – your ultimate partner for achieving optimal results in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on PCBs.

Nominal Supply Voltage (Vsup): 3.3 V

3.3V supply voltage is a common and standard voltage level for many electronic devices.

No. of Terminals: 32

Having 32 terminals allows for complex connections and functionalities within the IC.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance ensures stable performance even under harsh conditions.

Width (mm): 2.47 mm

Compact width dimensions make it suitable for applications with limited space constraints.

Maximum Output Current: 0.6 A

High maximum output current capability enables driving of power-hungry components or motors.

Technical Specifications

Motion Control ICs LV8415XA-MH attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B32

JESD-609 Code:

e1

Length:

2.47 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.69 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width (mm):

2.47 mm

Trade Compliance

LV8415XA-MH Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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