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LV8400V-TLM-E

Onsemi

LV8400V-TLM-E by Onsemi

LV8400V-TLM-E by Onsemi is a Motion Control IC with 16 terminals, operating voltage of 2.7-5.5 V, and max output current of 3.8 A. Ideal for BRUSH DC MOTOR CONTROL applications due to its BICMOS technology and compact design (5.2mm x 4.4mm).

Median Price

$1.450

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18 parts In-Stock

1+ parts

-

100+ parts

$1.450

1k+ parts

$1.300

10k+ parts

$1.220

18

-

$1.450

$1.300

$1.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 256 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

-

256

$1.530

-

-

-

Chip Stock

USA . 15,000 parts In-Stock

1+ parts

-

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15,000

-

-

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Vyrian

USA . 9,487 parts In-Stock

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9,487

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 18 parts In-Stock

1+ parts

$1.370

100+ parts

-

1k+ parts

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-

18

$1.370

-

-

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Corphita

USA . 624 parts In-Stock

1+ parts

$1.449

100+ parts

-

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624

$1.449

-

-

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Corohmni

South Africa . 78 parts In-Stock

1+ parts

$1.610

100+ parts

-

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78

$1.610

-

-

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AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$19.140

100+ parts

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10k+ parts

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884

$19.140

-

-

-

Perfect Parts

USA . 10,224 parts In-Stock

1+ parts

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10,224

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SupplyDigital Components

Austria . 5,358 parts In-Stock

1+ parts

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5,358

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Problanco Electronics

Mexico . 3,701 parts In-Stock

1+ parts

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3,701

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-

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TANS Electronics

Latvia . 3,680 parts In-Stock

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3,680

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Microchip USA

USA . 3,419 parts In-Stock

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3,419

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Kulean Microsystems

USA . 1,334 parts In-Stock

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1,334

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Kepictronics

USA . 700 parts In-Stock

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700

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UHIMA Technologies

Türkiye . 162 parts In-Stock

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162

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Overview

Discover the game-changing LV8400V-TLM-E by Onsemi, a top-tier manufacturer of Motion Control ICs. This innovative product offers seamless integration for brush DC motor control applications, ensuring optimal performance and efficiency. With a compact design and advanced technology, customers can expect precise control and reliability in their systems. Upgrade your projects with the LV8400V-TLM-E and experience the unmatched quality and value that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable electronics applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and reducing production costs.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard voltage level, compatible with most electronic systems.

No. of Terminals: 16

Sufficient number of terminals for connecting various components, allowing for flexibility in system design.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments, ensuring reliable performance under demanding conditions.

Minimum Operating Temperature: -20 °C

Can operate in low temperature environments, making it suitable for a wide range of operating conditions.

Maximum Output Current: 3.8 A

Capable of delivering high output current, suitable for driving brush DC motors efficiently.

Technical Specifications

Motion Control ICs LV8400V-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Length:

5.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

3.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LV8400V-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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