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LV4901H

Onsemi

LV4901H by Onsemi

LV4901H by Onsemi is a BICMOS audio amplifier IC with 2 functions, operating at temperatures from -25 to 70 °C. It has 44 terminals in a small outline package suitable for surface mounting applications. With a power supply of 12V and max current of 70mA, it's ideal for audio and video amplification needs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,559 parts In-Stock

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Digiode

USA . 1,077 parts In-Stock

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1,077

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TANS Electronics

Latvia . 7,545 parts In-Stock

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7,545

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Kulean Microsystems

USA . 4,407 parts In-Stock

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4,407

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Problanco Electronics

Mexico . 3,066 parts In-Stock

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3,066

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SupplyDigital Components

Austria . 2,627 parts In-Stock

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Corphita

USA . 1,371 parts In-Stock

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1,371

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Corohmni

South Africa . 383 parts In-Stock

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383

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UHIMA Technologies

Türkiye . 44 parts In-Stock

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Overview

Enhance your audio and video experience with the LV4901H by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The LV4901H, belonging to the Audio & Video Amplifiers category, offers seamless integration and exceptional performance. With its advanced technology and compact design, this amplifier provides customers with unparalleled value and benefits. Elevate your audio and video projects with the LV4901H from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the amplifier lightweight and durable, suitable for portable applications.

Surface Mount: YES

Surface mount design allows for easy installation and saves space on the PCB, making it suitable for compact designs.

No. of Functions: 2

Having multiple functions in a single amplifier provides versatility and efficiency in audio processing.

Package Shape: RECTANGULAR

The rectangular package shape enables easy placement and integration within electronic devices.

Power Supplies (V): 12

Operating at 12V provides sufficient power to drive audio signals while maintaining efficiency.

No. of Terminals: 44

Having 44 terminals allows for more connectivity options and customization in audio setups.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design enhance space-saving capabilities and ease of integration in tight spaces.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the amplifier can withstand prolonged use without overheating.

Minimum Operating Temperature: -25 °C

The ability to operate at low temperatures down to -25 °C makes the amplifier suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options and allows for diverse circuit configurations.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, ensuring high performance and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto the PCB, improving assembly efficiency.

Maximum Supply Current: 70 mA

With a maximum supply current of 70mA, the amplifier operates efficiently without drawing excessive power.

Terminal Pitch: 0.8 mm

0.8mm terminal pitch allows for closer terminal spacing, enabling more compact and space-efficient PCB designs.

Technical Specifications

Audio & Video Amplifiers LV4901H attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G44

No. of Functions:

2

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP44,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

70 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Trade Compliance

LV4901H General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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